Low Pressure Copper Pre-Preg

Coupler is a novel organic copper-clad laminate that is available with 40-50 micron molecularly flexible dielectric and as thin 1/4 oz copper layer for ultra-thin components and boards.

Coupler Packed Top

Fine Line

AIT patented (US patent#7,154,046; 6,717,819; 6,580,035; 6,581,276; 6,108,210; 6,297,564; 6,665,193; 6,973,716)) flexible circuit substrates (FCS) are organic copper-clad laminate that differs from traditional FCS in two fundamental aspects to give them the unparalleled reliability performance:

  • Instead of polyimide-adhesive or vacuum deposited copper laminates, its uses AIT proprietary flexible hydrophic dielectric insulating layer resulting in stress-free and high speed circuits and interconnections.
  • Unparalleled high temperature stability to withstand soldering at 300°C.
  • Multi-layer capability with the same flexible dielectric copper pre-preg that can be laminate at low pressure of less than 14 psi and 125°C or higher.
  • Thinner pre-preg are available in rolls of 24-inch width.
  • Thicker pre-preg are available in sheets of 24-inch by 24-inch.
  • Ideal for flexible circuits, fine-pitch interposers, power and LED components, modules.

Flexible Pre-Preg for Flex Circuits and Interposers

AIT Product Characteristics Copper Thickness(oz) Dielectric Thickness(mils) Nominal Stack Thickness (mils) DielectricStrength of Insulating Layer(Volt/mil) Dielectric Constant of Insulating Layer
COUPLERTMCPR-CU-1.00
  • Flexible Dielectric
  • Lamination Flow @>125°C and <14 psi
  • Withstands 300°C soldering
1 2 3.5 >1000 3.1
COUPLERTMCPR-CU-0.50
  • Flexible Dielectric
  • Lamination Flow @>125°C and <14 psi
  • Withstands 300°C soldering
1/2 2 2.75 >1000 3.1
COUPERTMCPR-CU-0.25
  • Flexible Dielectric
  • Lamination Flow @>125°C and <14 psi
  • Withstands 300°C soldering
1/4 2 2.38 >1000 3.1

Flexible Pre-Preg for Power and LED Modules

AIT Product Characteristics Copper Thickness(oz) Thermal Resistance(°C/W-in2) Nominal Stack Thickness (mils) DielectricStrength of Insulating Layer(Volt/mil) Dielectric Constant of Insulating Layer
COUPLERTMTPR-CU-1
  • Flexible thermal dielectric
  • Lamination Flow @>125°C and <14 psi
  • Withstands 300°C soldering
1 <1.1 88 >1000 4.5
COUPLERTMTPR-CU-2
  • Flexible thermal dielectric
  • Lamination Flow @>125°C and <14 psi
  • Withstands 300°C soldering
2 <1.1 115 >1000 4.5
COUPERTMTPR-CU-X
  • Flexible thermal dielectric
  • Lamination Flow @>125°C and <14 psi
  • Withstands 300°C soldering
Custom <1.1 Custom >1000 4.5

For more information and recommendation assistance, please contact AIT sales and engineering:

AIT Solve My Problem

AIT technical sales and service department can also be reached at: 1-609-799-9388 or 1-800-735-5040 (EST) and Fax: 609-799-9308