True Near-Hermetic Cavity Electronic Packaging Lid-Seal Solutions
Cost-effective, near-hermetic cavity packaging of electronic devices is becoming more important for the commercial electronics used in electric vehicles, smartphones, and sensor devices driving automation of all kinds. The reliability of these imaging and sensor devices depends on the cavity keeping out of corrosive environments such as moisture in combinations with ionic impurities and corrosive gases.
Reliability for Air Cavity Electronic Packaging Hinged on Lid-Sealing Adhesive and Isothermal Sealing Process with Inert Backfilled Air:
Reliable Cavity Electronic Packaging with LCP-grade Lid-Sealing Adhesive-Sealant with Matching Moisture and Corrosive Gases Barrier:
Wafer Scale Cavity Electronic Packaging with Pre-Applied Adhesive on Cap Wafer Blocking Moisture and Corrosive Gases Penetration:
Instead of time-consuming programmable dispensing and B-staging of lid-adhesive on cap-wafer, FLUOROSEAL® adhesive film can be melt-laminated onto cap-wafer and adhesive transferred to lid-rim ready for lid-sealing in wafer level.