EMI/RFI Shielding & ESD Protection

Conductive adhesives and sealants are important part of emi noise reductions in cellular phones and other communication devices.

EMI Lids

Printed circuit board shielding with conductive adhesive and sealants ensures low EMI/RFI noises for effective communications for cellular, WiFi, and RFID devices operating at UHF and microwave frequencies.

Circuit Board with Regions of Shielding

Inserted Lid

EMI/RFI Shielding Laminate Conductive Adhesives, Conductive Sealants and ESD Protective Coatings

Flexible conductive adhesive lamiantes used in shielding flexible printed circuit board are critical for the reduction of EMI noises in the smartphone applications.

AIT has been manufacturing and supplying EMI/RFI shielding coatings, caulks, adhesives and gaskets since 1981. We have one of the most experienced material engineering and application staff in the industry. The following are some representative products.

AIT Product Characteristics Electrical Resistivity (ohm-cm) Thermal Conductivity (watt/m-°C) Die-shear Cure
SR8850-1
  • EMI/RFI Shielding
  • Bonding mismatched CTE’s
  • Caulking
<5×10-3 >6.0 N/A 24 hrs. 25°C
SR8850-2
  • Conductive RTV Silicone
  • No Corrosive By Products
  • Caulking
<1×10-2 >6.0 N/A 24 hrs. 25°C
SR8850-3
  • EMI/RFI Shielding
  • No Corrosive By Products
  • Caulking
<5×10-3 >6.0 N/A 24 hrs. 25°C
SPC8015
  • EMI/RFI Shielding
  • Available in sheets or preforms
<5×10-3 >6.0 >300psi -As applied -60°C 16 hrs.

For more detailed specifications and application suggestions, please refer the following sections:

Compressible Conductive Gasket Sheets

Shielding Conductive Caulks and Adhesives

Melt-Bonding EMI Can/Cover/Lid Shield

For more information and recommendation assistance, please contact AIT sales and engineering:

AIT Solve My Problem

AIT technical sales and service department can also be reached at: 1-609-799-9388 or 1-800-735-5040 (EST) and Fax: 609-799-9308