Dicing & Grinding Tape FAQs

Frequently Asked Questions on Dicing Tape and Grinding Tape & Grease

The following are some of the typical processes for using dicing and grinding tapes:

Lamination Process for Dicing Adhesive Film to Wafer-Substrate

Application: Attaching wafer, substrate, and components before dicing, cutting, grinding or other operations.
Material: Melt-bonding dicing film adhesives from AIT have different “melt-bonding” temperatures. Adhesive must reach the melting temperatures for onset of flow and bonding with the prescribed pressure. Tacking and bonding are instantaneous once the melting temperature is reached.

  • MB7130 >130°C
  • MB7060 >70°C
Equipment: Dicing film adhesive has been successfully tacked onto a wafer with a standard office (PE/PP) plastic film laminator. Laminator should be expandable in thickness to accommodate your substrate. The lamination process will automatically eliminate voids within bonding areas. Any suitable vacuum based, pressurized equipment will be suitable.
Lamination Process:
  • Preheat the laminator to the required temperature. Remember, transferring heat to adhesive film needs a certain amount of time and depends on the speed of lamination.
  • Make sure there is a protective buffer liner to help prevent any stress concentration on the wafer. Any soft non-silicone rubber pad is suitable. A “Teflon” cloth of 2-6 mils has also been found to be suitable for most applications.
  • Sandwich the wafer to the adhesive with the release liner provided by AIT. A thermal transfer protective buffer is available from AIT, TP7178.
  • Pass the Protective buffer/Wafer/Adhesive film/Release liner.
  • Pass the same assembly through at least once again to ensure all corners reach the melt-tacking temperature.

 

Lamination Process for HTCR and CR Pressure-Sensitive Dicing Tape to Wafer-Substrate

Application: Lamination of wafers or substrates onto HTCR and CR (Pressure-sensitive) series tape before dicing, grinding (lapping) operation, or other applications.
Material: HTCR and CR (Pressure-sensitive) series of dicing and grinding (lapping) tape
Equipment: Dicing film adhesives have been successfully tacked onto wafers with standard office (PE/PP) plastic film laminator. Laminator should be expandable in thickness to accommodate your substrate thickness. The lamination process will automatically eliminate voids within bonding areas. Any suitable vacuum based, pressurized equipment will be suitable.
Lamination Process:
  • All pressure sensitive tape may be laminated at ambient temperatures.
  • Make sure there is a protective buffer liner to help prevent any stress concentration on wafer.
  • Any soft non-silicone rubber pad will be suitable. A “Teflon” cloth of 2-6 mils has also been found to suitable for most application.
  • Sandwich wafer to adhesive with release liner on adhesive (use the same liner provided by AIT) and thermal transfer protective buffer
  • Pass the Protective buffer/Wafer/Adhesive film/Release liner.
  • Pass the same assembly through at least once again to ensure all corners reach the melt-tacking temperature.

For a recommendation, information or assistance, please contact AIT sales and engineering:

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AIT technical sales and service department can also be reached at: 1-609-799-9388 or 1-800-735-5040 (EST) and Fax: 609-799-9308