AI Technology Application Analysis and Contact Request

At AI Technology, we are dedicated to making your application a success. The Application Analysis form below tells us what you are looking for and helps us recommend the right product for you. Application Analysis is also the first step in ordering a sample for evaluation. So please take a moment to tell us what you need. All you have to do is click on a few options. We promise, it’s fast and easy!

Contact Form

1. Customer Information: (* Required Field)

Name (required)
Email (required)
Company (required)
Title
Phone (required)
Fax
Address 1
Address 2
City
State / Province
Postal / Zip Code
Country

2. Application Categorization (Please select one):

Die Attach (Conventional Back-Side)Die Attach (Flip Chip)Die Attach (DDAF, Wafer Level)Dicing TapeGrinding TapeInsulated Metal Substrate for MCPCB (Thick Base Plate)Insulated Metal Substrate for MCPCB (Flexible)High Temperature Flexible Circuit SubstrateThermal Adhesive Tape/FilmThermal Adhesive PasteThermal Interface Pads (Phase Change, Conformable)Thermal Interface Gap-Filling (Compressible)Thermal Interface Greases/GelsSubstrate AttachComponent AttachSubstrate and Component Attach UnderfillLid Sealing - Paste (Dispensing and Screenable)Lid Sealing - Film and PreformsElectromagnetic Shielding - CoatingElectromagnetic Shielding - SealantElectromagnetic Shielding - Metal Tape with PSAElectromagnetic Shielding - SheetFilm (EMI/RFI)Solar - Back Sheet (Insulated thermal backsheet)Solar - Front SheetSolar - Tabbing AdhesiveSOLARTABCustom Material or Service (Please Specify)

3. Dispensing Requirements (Please select one):

Simple Needle Dispensing (Pressure-Time)Volumetric Needle Dispensing (Positive Displacement)Screen-StencilingFilm (Preform, Sheet, Roll)Other Dispensing Requirement (Please Specify)

4. Bonding and Curing Conditions (If Applicable):

Maximum Curing Temperature (°C):

Maximum Curing Time (Min/Hr):

Maximum Pressure in psi (Film Adhesives Only):

5. Technical Considerations:

Bonding Area (Dimensions):

Bond Line or Material Thickness:

Adherents and Substrates:

Electrical (Conductive, Insulating, or Semi Conductive):

Power of Attached Device, If Any (Watts):

Highest Exposed Temperature (°C):

Lowest Exposed Temperature (°C):

Max Temp Under Load >100 psi (°C):

Temperature Cycling (°C):

Other:

6. Annual Usage Volume:

Material Volume (Specify Units):
(e.g. 1000 Grams, 125 Sheets)

7. Additional Questions and Requirements:

8. Upload File: (Maximum file size is 5MB. Permitted file formats are .pdf, .zip, .gif, .jpg, .png)

Addresses

AI Technology Inc.
70 Washington Road
Princeton Junction, NJ 08550-1012
Phone: (800) 735-5040
Phone: (609) 799-9388
Fax: (609) 799-9308

China, AI Technology Inc.
Shenzhen, Guangdong, China
Phone: (0086) 755-83766778 and 83763739