Made-In-USA: Dicing For Wafer Dicing And Back Grinding Tapes And Grease-Adhesive For Wafer Thinning Applications
AIT is the only manufacturer of dicing tapes that can withstand high temperature exposure. This unique ability to tolerate high temperatures is further enhanced with unique anti-static highly stretchable substrate. UV-release versions with different peel strengths are also available.
The success of dicing tape is proven with 100% yield without die loss during the dicing process.
For a recommendation, information or assistance, please contact AIT sales and engineering:
AIT technical sales and service department can also be reached at: 1-609-799-9388 or 1-800-735-5040 (EST) and Fax: 609-799-9308