AI Technology is the only US company that manufactures dicing and back grinding tapes in an ISO 9001-2008 facilities, located in Princeton, NJ.
Besides the UV releasing and pressure sensitive types of dicing and grinding tapes that are proven to perform similarly to if not the same as equivalent Japanese manufactured products, AIT pioneers a unique high temperature stable dicing and grinding tape for more stringent applications.
Back Grinding tapes and wafer thinning thermal grease-adhesive
Dicing tapes that are compatible with all industrial standard processes and equipment
- High Temperature Back Grinding Tapes
- UV Releasing Back Grinding Tapes
- Vacuum wafer thinning thermal grease-adhesives
The extensive AIT reversible temporary bonding solutions are engineered specifically for the processing of compound semiconductors that often require back-thinning of the processed wafers or backside lithography. Wafers of GaAs, InP, SiC and other compounds are expensive and have relatively poor mechanical properties.
AIT’s reversible bonding wax film and spin coating solution are also ideal for carrier or submount substrates back-thinning and backside lithography processing. These carrier or submount substrates are typically sapphire, quartz, glass, or in some cases Si wafers.
Made-In-USA: Dicing For Wafer Dicing And Back Grinding Tapes And Grease-Adhesive For Wafer Thinning Applications
AIT is the only manufacturer of dicing tapes that can withstand high temperature exposure. This unique ability to tolerate high temperatures is further enhanced with unique anti-static highly stretchable substrate. UV-release versions with different peel strengths are also available.
The success of dicing tape is proven with 100% yield without die loss during the dicing process.
For a recommendation, information or assistance, please contact AIT sales and engineering:
AIT technical sales and service department can also be reached at: 1-609-799-9388 or 1-800-735-5040 (EST) and Fax: 609-799-9308