Automotive Electronic Adhesives & TIMs


What distinguishes AIT automotive electronic adhesive and thermal management material solutions besides the unparalleled and proven low thermal resistance in the die-attach, module mounting and heat-sink thermal interfaces are the long-term reliability and consistent performance after years of thermal shock and cycling with the build-in stress relief, and molecular structures that are engineered to prevent “drying” or cracking inside the materials and along the interface surfaces.

  1. Ultra-low electrical and thermal resistance between dies and sub-mount or substrate. Flexibility to produce camber-free, stress-free modules.
  2. For module and sub-mounting, molecular flexibility is specifically engineered in the thermal adhesive to provide stress absorption even in the most mis-matched CTE substrates and surfaces that extend to below -55°C. Depending on the assembly process, modules mounting has a choice of novel and the only proven pressure sensitive thermal adhesive or a melt-bonding thermal film adhesive.
  3. In the heat-sink interface layer, AIT provides the patented and proven compressible and conformable interface pad to eliminate trapped air and accommodate irregularity in gaps.
  4. Ultra-low thermal resistance gels and greases that are silicone free from drying and “pumped out”.
  5. Insulated metal thermal substrate (IMTS) for camber-free metal core printed circuit boards.
  6. RoHS, REACH and WEEE compliant that meets UL94V-0 rating.

Compressible Thermal Gap Pad Thermal Interface

  • Compressible and conformal
  • Proven for large area requiring thermal filling into height gaps of different components
  • Ideal for large area display and module to device enclosure
  • Proven and used for most critical thermal challenges with military grade reliability
  • Non-silicone and non-contaminating
  • Available with different thickness with one-side or both side pressure sensitive


Compressible Phase-Change Interface solution is a patented technology of AI Technology, Inc.

6,496,373 AI Technology, Inc. Compressible thermally-conductive interface


Unique Challenges for Automotive Electronic Adhesives & Thermal Interface Materials:

While the functional aspects of the typical die-attach, component attach, substrate attach and thermal management are the same for all of the automotive electronics, automotive electronics operational temperature tends to be a lot higher and conditions a lot harsher.

The temperatures of power electronics like insulated gate bipolar transistors (IGBTs) can operate around 150C. Some electronics may be exposed to solvents (fuels) and other chemicals.

With over 30 years of experience in inventing and formulating specialty adhesives for electronic applications, AIT provides one of the most comprehensive thermal interface solutions that are engineered to facilitate manufacturability and throughput:

  • High thermal automotive power electronic die-attach pastes
  • Compressible pressure sensitive thermal tape and thermal film adhesives that have been proven industry best to provide instant bonding and lowest thermal resistance for large area module mounting
  • Conformal compressible phase change or pressure sensitive thermal interfaces for modules to heat-sink thermal interface for largest displays
  • Camber-free insulated metal thermal substrate for metal-core printed wiring board (MCPWB) with measurable 2x better thermal conductivity

Electro-Thermal & Dielectric-Thermal Die-Attach

  • Low Thermal Resistance for Higher Power Automotive Electronics
  • Modified Epoxy for camber-free Bonding
  • Maintain Stable Bond Strength for Extreme Thermal Shock and Cycling
Electrical Resistivity <0.0003 ohm-cm <0.0003 ohm-cm <0.003 ohm-cm >10¹⁴ ohm-cm
Viscosity @5.0 rpm/Thixotropic Index 10,000 cps/4.0 20,000 cps/4.0 10,000 cps/4.0 20,000cps/>3
Glass Transition Tg (°C) 52 -20 220 52
Device Push-off Strength (psi) >3000 >2000 >3000 >3000
Hardness (Type) ~ 80D ~ 80A ~ 99D ~ 85D
Cured Density of Conductive Adhesive Portion (gm/cc) 4.0 4.8 4.0 2.5
Thermal Conductivity > 12.0 W/m-°K > 12 W/m-°K > 8 W/m-°K > 12 W/m-°K
Linear Tab-Composite Thermal Expansion Coefficient  (ppm/°C) 40 (X-Y=Z,  Isotropic) 90 (X-Y=Z,  Isotropic) 26 (X-Y=Z,  Isotropic) 45 (X-Y=Z,  Isotropic)
Maximum Continuous Operation Temperature (°C) > 180 > 180 > 250 > 180
Decomposition Temperature @5% weight loss (°C) >450 >450 >500 >450
Recommended Curing Temperature/Time (°C/min.) >175/10 >175/10 >150/10 >175/10

Lowest Possible Die-Attach Thermal Interface is teh Foundation of Automotive Power Electronics Thermal Management:

Die-Attach thermal management is the first and most critical layer of the thermal stacks in a power electronic and LED module devices. Highest thermal conductivity with thin and void-free bond-line of the die-attach adhesive is critical in dissipating the heat quickly to the broader sub-mount and eventually to the heat-sink.

Module Mounting and Sub-Mounting Thermal Adhesives
Thermal Conductivity > 0.2 W/m-°C > 0.2 W/m-°C > 0.2 W/m-°C
Dielectric Strength (Volts/mil) >550 >300 >750
Device Push-off Strength (psi) >1000 >1000 >1000
Cured Density (gm/cc) 2.5 2.5 2.5
Thermal Conductivity > 3.0 W/m-°C > 8.0 W/m-°C > 12 W/m-°C
Maximum Continuous Operation Temp. (°C) > 150 > 150 > 150
Electrical Resistivity >10¹⁴ ohm-cm >10¹⁴ ohm-cm >10¹⁴ ohm-cm

Extreme Thermal Adhesive for Module Mounting

  • Instant Bonding Compressible Pressure Sensitive Adhesive Pad
  • Melt-tacking and In-situ Curable Low Thermal Resistance Film Adhesive
  • Proven Lower Junction and Device Temperature

Compressible Phase-Change Thermal Interface Pads

  • Compressible and conformal couples with phase change to allow elimination of voids
  • Proven for most stringent applications including military applications
  • US patented innovation
  • Non-silicone and non-contaminating
Other AIT Thermal Interface Materials for Automotive Power Electronics Applications
Compressible Phase-Change COOL-SILVER™ PAD CPR8850-LB
  • Lowest thermal resistance, electrically non-conductive interface pad
  • Compressible, phase-change interface pad  (US patented)
Compressible Phase-Change COOL-SILVER™  G3 PAD
  • Lower cost version of the lowest thermal resistance pad
  • Compressible, phase-change interface pad  (US patented)
Compressible Phase-Change COOL-PAD™  CPR7158
  • Modified aluminum nitride filled with one of the lowest thermal resistance
  • Compressible, electrically insulating phase-change pad (US patented)
Compressible Phase-Change COOL-PAD™  CPR7155-LB
  • Modified aluminum oxide filled with one of the lowest thermal resistance
  • Compressible, electrically insulating phase-change pad (US patented)
Gap-Filling Thermal Pad COOL-GAPFILL™


  • Gap filling compressible  thermal pad with the lowest thermal resistance
  • One-side tacky (DT) or both side tacky (TT) for different applications
Compressible Gel-Film COOL-GELFILM™


  • Thin compressible gel like film
  • Non-curing thin bond-line thermal interface
Thermal Grease COOL-SILVER™

G3 Grease

  • Non-curing, electrically non-conductive interface grease
  • Lowest thermal resistance, non-silicone, proven long-term stability
Thermal Grease COOL-GREASE™


  • Lowest thermal resistance, electrically insulating interface grease
  • Non-curing, non-silicone, proven long-term stability
Thermal Gel COOL-SILVER™

G3 Gel

  • Non-curing, electrically non-conductive interface gel forming paste
  • Non-silicone grease, proven thermal stability similar to thermal pad
Electro-Grease COOL-GREASE™


  • Non-curing, electrically conductive interface grease for moving parts
  • Lowest thermal resistance non-silicone grease, proven long-term stability

Comparison of Thermal Interface Materials Performance: Lower temperature rise represents a measurement of the efficiency of the thermal interface materials in transferring heat generated by the power electronic device to the heatsink (with fan) that dissipates heat to the environment by the forced circulating air. The thickness of the thermal interface material also contributes significantly to the efficiency of heat dissipation and should be minimized as much as the physcial configuration or construction permits. The effectiveness of a specific thermal interface material cannot be easily predicted by the claimed or even measured bulk thermal conductivity data or value: the thermal resistance at the thermal interface material to the substrates in their respective interfaces for thin bondline or interface thickness are significant and represents the “coupling efficiency” that cannot be predicted and must be measured.

The data in the comparison of thermal interface materials are collected by using an Intel CPU and forced air heatsink as represented in the above configuration. A thermocouple is drilled and embedded at the heatsink junction that interface with the thermal interface material to provide direct temperature data at the interface for measuring the “coupling” of the specific thermal interface materials to the heatsink.

AIT application engineering, sales, chemists, and material scientists are ready to serve your special needs and applications. Please inform us of your requirements using the Contact tab or click on the button below:

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AIT technical sales and service department can also be reached at: 1-609-799-9388 or 1-800-735-5040 (EST) and Fax: 609-799-9308