New Generation of Ultra High Tg Underfill
with Glass Transition of Over 240°C for Ultimate Flip-Chip and Component Stress Management
Liquid Underfills with Ultra-high Glass Transition (Tg):
- Balancing these modified cyanate ester underfills that cure to much higher glass transition temperatures and the stress absorption.
- Outstanding thermal conductivity and low thermal resistance afford better thermal dissipation from powerful chip to both side of the microelectronic package.
- Proven in use for the most stringent military applications
High Melt-Flow Film Underfill for FOW:
- Outstanding melt-flow and wetting to flow-over-wire for stack-chip applications
- Ability to cure at lower temperature from 100-150°C for lower interfacial stresses
- Ideal for large area stack-chip and module
- Preform with specific thickness accommodates the flip-chip or ball-grid-array parts with preformed cut-outs for interconnections allowing the film adhesive to flow and encapsulate for protection
Flow-Over-Wire underfill film adhesive is available in DDAF format for large scale wafer level packaging
Underfill Liquids and Film Adhesives:
FUNCTION | AIT PART# | THERMAL, ELECTRICAL, & other RELEVANT PROPERTIES |
Underfill Film Adhesive for Wafer or Chip | UFF-ESP7770 |
|
Underfill Film Adhesive for Wafer or Chip (REWORKABLE) | UFF-RW-ESP7760 |
|
Underfill Film Adhesive for Wafer or Chip | UFF-CXP7880 |
|
Underfill Film Adhesive for Wafer or Chip (REWORKABLE) | UFF-RW-CXP7860 |
|
The ultra-high glass transition temperature (Tg) at 240°C minimizes tensile stress induced failures when the flip-chip packages are going through the reflow soldering of lead-free solder.
For more information and recommendation assistance, please contact AIT sales and engineering:
AIT technical sales and service department can also be reached at: 1-609-799-9388 or fax: 609-799-9308