Thermal Tape Adhesives and Thermal Epoxies

Thermal Tape Adhesives, Thermal Film Adhesives and Thermal Adhesives

AIT has one of the most comprehensive lines of thermal adhesives available in different dispensing formats for a variety of placement conditions, operating environment variables and performance requirements, including:

  • Compressible and curing pressure sensitive thermal adhesive tapes and films
  • Dry thermal epoxy tapes for high volume pick and place film adhesive applications
  • Tacky thermally conductive epoxy film adhesives for ease of component positioning
  • Instant melt-bonding thermally conductive film adhesives for ultimate productivity
  • One-component heat curing thermal epoxies
  • Two-component ambient curing thermal epoxies

PGA Processor

AIT thermal tape adhesives and thermal adhesive pastes have been used extensively for high performance power devices, military applications and space modules over the last 26 years.

Thermal Preform

Film thermal adhesives and thermal tape adhesives are available in die-cut forms packaged in preforms or roll-to-roll presentation.

Thermal Adhesive Products

AIT provides die cutting services of thermal adhesive tapes and films including the use of a rotary die for ultimate volume requirement, a laser die-cut for specialty and stringent formats and an automated and programmable dicing and standard steel-rule die for extra high thickness.

Circuit Board

AIT offers pressure sensitive thermal tape adhesives that provide instant bonding of more than 100 psi and dissipate heat with high efficiency as applied. Non-curing versions will remain in the same pressure sensitive state while curing versions will insitu cure during usage for beyond 1000 psi while maintaining molecularly flexible for a stress free interface.

The failure rate of an electronic device doubles with every 10°C increase in chip junction temperature!

Thermal Adhesive Tapes and Films and Thermal Adhesive Pastes for Ultimate Performance and Operating in Extreme Environments

AIT has provided a comprehensive line of thermal adhesives with low to zero interface stress along the bondline for proven long-term reliability for over 25 years. These thermal adhesives include: thermal epoxies in tape adhesive (film adhesive) form factors and thermal epoxies in easy dispense paste form factors for managing thermal dissipation in die, component and module levels of electronic packaging.

Purchase COOL-GELFILM™ for testing: http://www.ebay.com/itm/COOL-GELFILM-SZ-Thermal-Interface-Film-Pad-TIM-/151026947175?pt=US_Thermal_Compounds_Supplies&hash=item2329e85467

Thermal Adhesives and Thermal Epoxies in Dispensing Paste Form Factors

AIT Product Characteristics Electrical Resistivity (ohm-cm) Thermal Conductivity(watt/m-°C) Die-shear (psi) Tg (°C) Viscosity
ME7155
  • Solvent free
  • Stress free
>1×1014 >1.7 >1,800 -25 276,000 (cps@ 0.5 rpm)
ME7156
  • Stress free
  • Mismatched CTE’s
>1×1014 >1.7 >2,400 -25 144,000 (cps@ 0.5 rpm)
ME7159
  • Stress free
  • Diamond filled
>1×1014 >11.4 >1,800 -25 310,000 (cps@ 0.5 rpm)
ME7638-RC
  • 1 component
  • 7 days pot-life min.
  • Rapid inline curing @ 150-175°C
  • Automatic consistent dispensing
>1×1014 >3.0 >3,000 60 10,000 (cps@ 0.5 rpm) TI >4.0
ME7658-RC
  • 1 component
  • 7 days pot-life min.
  • Rapid inline curing @ 150-175°C
  • Automatic consistent dispensing
>1×1014 >3.0 >1,500 -25 60,000 (cps@ 0.5 rpm) TI >3.0

Electrically and Thermally Conductive Thermal Epoxies in Dispensing Paste Form Factors

AIT Product Characteristics Electrical Resistivity (ohm-cm) Thermal Conductivity(watt/m-°C) Die-shear (psi) Tg (°C) Viscosity
EG8050
  • Stress free
  • One or two component
  • Large bonding areas
<4x10-4 >6.0 >1,800 -20 300,000 (cps@ 0.5 rpm)
ME8456-00
  • Solvent free
  • Stress free
<4x10-4 >12.5 >1,200 -20 60,00 (cps@ 2.5 rpm)
ME8456-LV GS002
  • Stress free
  • Mismatched CTE’s
<4x10-4 >7.9 >2,400 -25 144,000 (cps@ 0.5 rpm)
ME 8650-RC
  • Solder replacement
  • Rapid curing
  • Molecularly flexible
  • More than 7 days pot-life
  • Easily dispensed & screen printable
<4x10-4 >6.0 >1,500 -20 15,000 (cps@ 0.5 rpm) TI >4

Thermally Conductive & Electrically Insulating Thermal Tapes and Thermal Pads in Film Adhesive Form Factors

AIT Product Characteristics Electrical Resistivity (ohm-cm) Thermal Conductivity (watt/m-°C) Die shear (psi) Tg (°C) Film Type
COOL-BOND® CP7138
  • Instant melt-tack >150°C (<10 psi)
  • No curing required
  • Low moisture absorption
  • Proven reliability for large area substrates
>1×1014 >4.0 >1000 -55 Tack free dry film Preforms 3-12 mils (thick)
COOL-BOND® CB7208-A
  • Instant tack with 10 psi for 300 psi bond
  • Insitu curing, no special curing process
  • Proven reliability for large area substrates
>1×1014 >3.6 750 -25 Tacky film Preforms 3-12 mils (thick)
ESP7455
  • Instant melt-tack >120°C (<10 psi)
  • Curing without fixture and pressure
  • Withstand >300°C short-term exposure
  • Low moisture absorption
  • Proven reliability for large area substrates
>1×1014 >2.0 >1,500 -45 Tack free dry film Preforms 3-12 mils (thick)
RTK7555
  • Tacky for instant placement without fixture
  • Curing without fixture and pressure
  • Low moisture absorption
  • Proven reliability for large area substrates
>1×1014 >2.0 >1,500 -45 Tacky film Preforms 3-12 mils (thick)
RTK7553
  • Tacky for instant placement without fixture
  • Curing with fixture or low pressure
  • Withstand high temperature excursion
  • Molecularly flexible for low interfacial stress
  • Proven reliability for large area substrates
>1×1014 >3.6 >1,500 -20 Tacky film Preforms 3-12 mils (thick)

Electrically and Thermally Conductive Pads and Tape Adhesives in Film Form Factors

AIT Product Characteristics Electrical Resistivity (ohm-cm) Thermal Conductivity (watt/m-°C) Die shear (psi) Tg (°C) Film Type
ESP8450-WL
  • Instant melt-tack >120°C (<10 psi)
  • Curing without fixture and pressure
  • Withstand >150°C wire-bonding
  • Low moisture absorption
  • Proven reliability for large area bonding
<4x10-4 >6.0 >1,500 -45 Tack free dry film Preforms 3-12 mils (thick)
RTC8750
  • Tacky for instant placement without fixture
  • Curing with fixture or low pressure
  • Withstand high temperature excursion
  • Molecularly flexible for low interfacial stress
  • Proven reliability for large area substrates
<4x10-4 >8.0 >1,500 -25 Tacky film Preforms 3-12 mils (thick)

The performance of AIT’s pressure-sensitive thermal tape adhesive has been proven in many industrial computers, LED displays, large area thermal bonding and in difficult thermal management applications. COOL-BOND PSA-3NC and COOL-BOND PSA-4TC have been used extensively by professionals and hobbyists alike to bond graphic processor units (GPU) and memory modules to a heatsink and/or heatspreader with or without mechanical fasteners.

COOL-BOND PSA-3NC had received wide acclaims in the hobbiest and gaming communities for bonding and/or thermal interfacing between heat generating devices and heatsink.

Purchase COOL-BOND™ for Testing:

http://www.ebay.com/itm/COOL-BOND-Thermal-Adhesive-Tape-Pad-Interface-TIM-/150802951348?pt=US_Thermal_Compounds_Supplies&hash=item231c8e6cb4

AIT offers many other Electrically and Thermally conductive film adhesive materials not shown on our web site. Please go to the Product Application Form to receive a recommendation from our office on your specific application. AIT has a team of experienced engineers, scientists, sales and service staff ready to serve your needs for any electronic and semi-conductor packaging material solutions. We pride ourselves to provide products that meet your needs!

AIT, solve my problem!

AIT technical sales and service department can also be reached at: 1-609-799-9388 or 1-800-735-5040 (EST) and Fax: 609-799-9308