Compressible and Phase-Change Interface Materials
The illustration above demonstrates the use of COOL-PAD CPR7156. It is a patented AIT phase-change pad that is compressible and when eliminates trapped interface trapped airs and voids upon reaching temperature heat up above 45°C. They have been proven to provide outstanding performance for LED modules in luminaire lighting industry.
COOL-SILVER PAD is one of the lowest thermal interface pad that was proven to perform the same as the best of thermal greases. Even in the consumer applications in over-clocking and gaming communities, COOL-SILVER Pad had received unparalleled rating in eBay buyers.
Purchase COOL-SILVER PAD for testing: http://www.ebay.com/itm/COOL-SILVER-Thermal-Pad-Phase-Change-Thermal-Compound-/230759985996?pt=US_Thermal_Compounds_Supplies&hash=item35ba5df34c
COOL-GUMPAD™ (20 mil or 40mil=1.0mm thickness) Compressible and Conformable Thermal Interface (TIM) Pad for LED Luminaire, Large MCPWB and Electronic Power Module Heat Dissipation: COOL-GUMPAD™ CGP7156 is a new class of thermal interface material that dispenses like a thermal pad, but performs with characteristics like that of a grease or gel when device temperatures increase to above 45°C.
COOL-PAD™ CGP7156 is designed for thermal interface applications to withstand the worst of temperature and moisture exposure in outdoor LED luminaire applications of outdoor LED lighting. Of course, the same phase-change pad works great for large area power modules, power converters for solar panels, metal core printed circuit boards populated with components that have substantial different height.
Side-by-side comparative performance measurements in comparison by direct replacing standards pads find in LED luminaire lighting modules to AIT COOL-GUMPAD, the temperature is lower the temperature by 10-20% from heat-sink to module junction temperature from 60°C to less than 56°C.
COOL GUMPAD and COOL GAPFILL have proven to combine the ease-of-application and performance-reliability in high power LED Luminaire thermal management and power module heat dissipation
COOL-GELFILM™ is a thermal interface gel in film format for ease of application for critical thermal interfacing requiring high reliability without heat of provision of clips or pressure. COOL-GELFILM™ is a compressible and comformable thermal interface material which does not phase change but is pressure sensitive to provide immediate thermal interface performance.
COOL-GAPFILL™ is yet another enhanced thermal gap-filling material that provides extreme thermal conductivity and thus unparalleled thermal interface resistance for board level multiple component thermal management. It is designed to provide conformability and compressibility to bridge the thermal gap of large boards and sensitive components. It is non-phase changing and doesn’t contain silicone, thus it will not contaminate components. One side of COOL-GAPFILL™ is dry but easily removed and the other side is heat-sinking or heat-spreading and pressure sensitive to provide optimum thermal interface with low thermal impedance and thermal resistance.
AIT invites anyone interested in using our COOL-GELFILM™ or COOL-GAPFILL™ to make compressible phase-change materials for use in electronic and other device applications to contact us for licensing. (based on AIT’s US patent 6,496,373).