Compressible and Phase-Change Interface Materials

The illustration above demonstrates the use of COOL-PAD CPR7156. It is a patented AIT phase-change pad that is compressible and when eliminates trapped interface trapped airs and voids upon reaching temperature heat up above 45°C. They have been proven to provide outstanding performance for LED modules in luminaire lighting industry.

COOL-SILVER PAD is one of the lowest thermal interface pad that was proven to perform the same as the best of thermal greases. Even in the consumer applications in over-clocking and gaming communities, COOL-SILVER Pad had received unparalleled rating in eBay buyers.

Purchase COOL-SILVER PAD for testing: http://www.ebay.com/itm/COOL-SILVER-Thermal-Pad-Phase-Change-Thermal-Compound-/230759985996?pt=US_Thermal_Compounds_Supplies&hash=item35ba5df34c

COOL-GUMPAD™ (20 mil or 40mil=1.0mm thickness) Compressible and Conformable Thermal Interface (TIM) Pad for LED Luminaire, Large MCPWB and Electronic Power Module Heat Dissipation: COOL-GUMPAD™ CGP7156 is a new class of thermal interface material that dispenses like a thermal pad, but performs with characteristics like that of a grease or gel when device temperatures increase to above 45°C.

COOL-PAD™ CGP7156 is designed for thermal interface applications to withstand the worst of temperature and moisture exposure in outdoor LED luminaire applications of outdoor LED lighting. Of course, the same phase-change pad works great for large area power modules, power converters for solar panels, metal core printed circuit boards populated with components that have substantial different height.

Side-by-side comparative performance measurements  in comparison by direct replacing standards pads find in LED luminaire lighting modules to AIT COOL-GUMPAD, the temperature is lower the temperature by 10-20% from heat-sink to module junction temperature from 60°C to less than 56°C.

COOL GUMPAD and COOL GAPFILL have proven to combine the ease-of-application and performance-reliability in high power LED Luminaire thermal management and power module heat dissipation

COOL-GELFILM™ is a thermal interface gel in film format for ease of application for critical thermal interfacing requiring high reliability without heat of provision of clips or pressure. COOL-GELFILM™ is a compressible and comformable thermal interface material which does not phase change but is pressure sensitive to provide immediate thermal interface performance.

Cool Gelfilm Pad

COOL-GAPFILL™ is yet another enhanced thermal gap-filling material that provides extreme thermal conductivity and thus unparalleled thermal interface resistance for board level multiple component thermal management. It is designed to provide conformability and compressibility to bridge the thermal gap of large boards and sensitive components. It is non-phase changing and doesn’t contain silicone, thus it will not contaminate components.  One side of COOL-GAPFILL™ is dry but easily removed and the other side is heat-sinking or heat-spreading and pressure sensitive to provide optimum thermal interface with low thermal impedance and thermal resistance.

Heat Sink Pad Processor

AIT invites anyone interested in using our COOL-GELFILM™ or COOL-GAPFILL™ to make compressible phase-change materials for use in electronic and other device applications to contact us for licensing. (based on AIT’s US patent 6,496,373).

Phase-Change Pad Thermal Interface Materials, Compressible Phase-Change Pad Thermal Interface Materials, Compressible and Conformal Thermal Interface Gap Pads, and Pressure Sensitive Thermal Pads

AIT pioneered the use of phase-change materials for use as thermal interface adhesive materials for thermal management in the early 1990’s.  AIT’s phase change materials and speciality adhesives have been used in both military and commercial electronics over the last 15 years. AIT has patented the use of “compressible phase-change” thermal interface materials and “in-situ curing” thermal interface adhesive materials with one of the lowest available thermal interface resistance.

This new class of compressible phase change gap-filling materials enables the filling of large gaps between heat-spreader and heat generating components that may have substantially different heights.  The following data represents some of these innovative gap-filling phase change interface materials and their solutions and advantages:

  • Compressible phase-change interface materials compensate for large areas and extreme height differentials and gaps.
  • In-situ curing thermal interface adhesive materials provide up to 300 psi as applied and cure to over 600-1200 psi over time at operating temperatures of the device.
  • Available as electrically conductive or electrically insulating thermal adhesive, thermal grease, thermal gel and thermal pad.
  • Available as dry, single-sided or double-sided pressure sensitive tacky thermal interface pad and thermal adhesives film tape.
  • Available in preformed thermal phase change material pad and thermal adhesive film or tape.
  • Phase-change thermal interface pad materials flow at 55°C, 90°C, 130°C, and 180°C respectively.
  • Phase-change materials, such as adhesives, greases, gels and gap filling compressible thermal pads are available in all thicknesses and offer outstanding thermal conductivity and low thermal interface resistance to help cool and manage power devices.

Electrically Insulating Compressible Phase-Change Thermal Interface Materials & In-situ Curing Thermal Interface Adhesives

AIT Product Characteristics Electrical Resistivity (ohm-cm) Thermal Conductivity(watt/m-°C) Dielectric Strength (volt/mil) Die-shear (psi) Tg (°C)
COOL-BOND® CB7065 -In-situ curing >60°C
-Flexible to -55°C
>1×1014 >2.0 >550 >600 -55
COOL-BOND® CB7068 -In-situ curing >60°C
-Flexible to -55°C
>1×1014 >4.0 >550 >600 -55
COOL-BOND® CB7135 -High Melt-Flow >135°C
-Flexible to-55°C
>1×1014 >2.0 >550 >800 -55
COOL-BOND® CB7138 -High Melt-Flow >135°C
-Flexible to -55°C
>1×1014 4.0 >550 >600 -55
COOL-BOND® CB7208-A -In-situ curing -Pressure Sensitive >1×1014 3.6 750 >600 -25
COOL-BOND® CB7208-EDA -In-situ curing >60°C
-100 psi die-shear as applied
>1×1014 >3.6 750 >600 -25
COOL-BOND® CB7205-E -In-situ curing >60°C
-50 psi die-shear as applied
>1×1014 >1.9 750 >300 -25
COOL-PAD™ CPR7158 -Non-curing -Compressible phase-change pad >1×1014 >3.0 550 NA -45
COOL-PAD™ CPR7155 -Non-curing -Compressible phase-change pad >1×1014 >2.0 550 >600 -45
COOL-PAD™ CP7065-KP -Melt-Flow @ 65°C -Power Device to Heat-sink >1×1014 2.0 >6000 NA -55
COOL-PAD™ CP7066 -Melt-Flow @ 50°C -Low Bond Strength >1×1014 4.0 550 <100 -55
COOL-PAD™ CP7068 -Melt-Flow @ >70°C -Aluminum Nitride filled Dry Film >1×1014 4.0 >550 <300 -55
COOL-PAD™ CP7108 -High Melt-Flow @ >135°C
-Aluminum Nitride filled Dry Film
>1×1014 >4.0 >550 <900 -55
COOL-PAD™ CP7135 -High Melt-Flow @ >135°C
-Aluminum Oxide filled Dry Film
>1×1014 2.0 >550 >800 -55
COOL-PAD™ CP7135-KP -High Melt-Flow @ >135°C
-Kapton lined
>1×1014 2.0 >5000 >800 -55
COOL-PAD™ CP7138 -High Melt-Flow @ >150°C
-Aluminum Nitride filled Dry Film
>1×1014 4.0 >550 >700 -55
COOL-PAD™ CP7138-2KP -High Melt-Flow @ >135°C
-Kapton lined
>1×1014 4.0 >3000 >800 -55
COOL-PAD™ CP7175 -Puncture Resistant Pad ->1500V Insulation @ 3 mil -Polyimide laminates availible >1×1014 1.8 >750 NA -55
COOL-PAD™ CP7178 -Non-curing -Non-flowing -Thermal gasket pad -Polyimide laminates availible >1×1014 >3.0 550 NA -45
COOL-PAD™ CP7505 -Melt-Flow @ 55°C -Aluminum Oxide Filled Dry Pad >1×1014 1.8 >550 <40 -55
COOL-PAD™ CP7506-HFT -High Flow @ 50°C -One side Tacky film >1×1014 4.0 >550 <100 -55

AIT offers many other phase change and non-phase change materials for use as thermally conductive materials that may not be shown on our web site. Please go to Product Application Form to receive a recommendation from our office on your specific application.

Purchase COOL-GELFILM™:

http://www.ebay.com/itm/COOL-GELFILM-SZ-Thermal-Interface-Film-Pad-TIM-/150657978173?pt=US_Thermal_Compounds_Supplies&hash=item2313ea4f3d

Electrically Conductive Compressible Phase-Change Thermal Interface Materials & In-situ Curing Thermal Interface Adhesives

AIT Product Characteristics Electrical Resistivity (ohm-cm) Thermal Conductivity(watt/m-°C) Die-shear (psi) Tg (°C)
COOL-BOND® CB8130 -High Melt-Flow
-Dry film for easy handling
<1x1014 >3.0 550 -45
COOL-BOND® CB8130-XT -Extra High Thermal Conductivity
-Extra High Electrical Conductivity
<2x10-4 >16 >400 -55
COOL-BOND® CB8133 -Silver Plated Copper Filled
-Lower cost solution
<5x10-3 >8 >800 -55
COOL-BOND® CB8205-EJD -In-situ curing >60°C
-300 psi die-shear bond strength as applied
<5x10-3 >5.7 >600 -25
COOL-BOND® CB8250-E -Pressure Sensitive, Cross-linkable
-Improved Bond Strength
<5x10-3 >3.6 >1000 -55
COOL-PAD™ CP8550 -Phase change
-Dry pad
<4x10-4 >9.0 >100 -55
COOL-PAD™ CP8550-HF -Phase change
-Dry pad
-High flow
<4x10-4 >9.0 >100 -55
COOL-PAD™ CP8550-HFT -Electrical & thermal
-Ground plane interface
<4x10-4 >9.0 >100 -60
COOL-PAD™ CPR8850 -Non-curing -Compressible phase-change pad <5x10-4 >9.4 N/A -60
COOL-PAD™ CPR8850-XT -Non-curing
-Compressible phase-change pad
<5x10-4 >9.4 N/A -60
COOL-PAD™ CPR8853 -Non-curing
-Compressible phase-change pad
<5x10-3 >9.4 N/A -60

AIT offers many other phase change materials that are electrically and/or thermally conductive interface materials not shown on our web site. Please go to the Product Application Form to receive a recommendation from our office on your specific application.

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