Wafer Back Grinding Tapes

NON-SILICONE, NON-EVA BASED COMPRESSIBLE BACKGRINDING AND THINNING TEMPORARY BONDING ADHESIVE TAPES FOR BUMPED WAFERS AND SUBSTRATES WITH UP TO 250 MICRON BUMP HEIGHTS:

The configuration of the temporary bonding adhesive tapes are engineered for high reliability for wafers and substrates with extensive bumped features or flat with nominal or no features.

  • Protect and encapsulate the gold, solder or copper bumps or columns during the backgrinding and thinning process
  • All component materials in the temporary bonding tapes are engineered with high molecular stability to withstand high temperature exposure up to 250°C.
  • Typical temporary bonding and backgrinding operations leave no or minimal residual on the wafers or substrates and require no cleaning.
  • Any minor residual after extended high temperature and /or high pressure operations may be easily cleaned with IPA rinsing.

AIT Backgrinding Tape Adhesive General Features:

  • Non-contaminating low ionic adhesive that is engineered for wafer thinning application
  • Strong adhesion to wafer with hydrophobic property to prevent water seepage for stable consistent backgrinding
  • Consistent bond strength during grinding process
  • Withstands high temperature and maintains high temperature peel strength
  • On-Demand ease to peel release upon UV exposure
  • Proven for wafer, panel of modules, glass and other substrate
  • Adhesive-compliant buffer layer of 500 micron on strong transparent substrate for solder-bumped wafer thinning
  • 100 micron adhesive layer on strong transparent substrate for gold-bumped wafer thinning

Wafer in Die Ejector

The extensive AIT reversible temporary bonding adhesive solutions are engineered specifically for the processing of compound semiconductors and often require back-thinning of the processed wafers or backside lithography.  Wafers of GaAs, InP, SiC and other compounds are expensive and have relatively poor mechanical properties.

AIT reversible bonding wax film and spin coating adhesive solutions are also ideal for carrier or submount substrate back-thinning and backside lithography processing. These carrier or submount substrates are typically sapphire, quartz, glass, or in some cases Si wafers.

BACKGRINDING & THINNING TEMPORARY BONDING TAPE ADHESIVE SOLUTIONS for WAFERS and SUBSTRATES

  • UV, Heat & Peel Releasing Adhesive Tapes for Bumped Wafer or Substrate
  • High Temperature and Anti-Static for More Reliable Operations

Wafers requiring grinding and thinning to 50 microns needs high performance adhesion and yet easily release on demand either by UV or heat curing

AIT wafer and substrate grinding and thinning temporary bonding adhesive tapes are made in the United States with Company Service Centers in China and USA. The high temperature controlled release tape has a conformable compressible layer of 150 and 300 micron thickness to accommodate bumped wafers with gold or solder bumps respectively.

AIT UV releasing temporary bonding tape adhesives offer options of different operational bond strength and PET or LCP carrier base film for operations at 150C and 250C respectively.

Properties of AIT BACK-GRINDING TAPE ADHESIVES for Bumped Wafers

PARAMETER BG-UVR100-PET BG-HTCR100-PET BG-HR200-PET
Release Mechanism-Material and Thickness UV Exposed Controlled Peel Heat Curing Release
Carrier Support Film and Thickness
  • PET or LCP
  • 75 Microns
  • PET or LCP
  • 75 microns
  • PET or LCP
  • 75 microns
Thickness of Compressible-Compliant Layer
  • 150 micron version
  • 300 micron version
  • 150 micron version
  • 300 micron version
  • 150 micron version
  • 300 micron version
Peel Strength in Operation (gpi)
  • 100 gpi
  • 250gpi, 500 gpi (option)
  • 100 gpi
  • 250 gpi, 500 gpi (option)
  • 200 gpi
  • 100 gpi, 500 gpi (option)
Peel Strength for Release (gpi) 25 gpi nominal 100 gpi nominal 25 gpi nominal
Operational Temperature Capability
  • 150°C (PET Version)
  • 250°C (LCP Version)
  • 150°C (PET Version)
  • 250°C (LCP Version)
  • Peel lower when exposed to 150°C
Chemical Resistance Outstanding Outstanding Outstanding
Water Jet Resistance Outstanding Outstanding Outstanding
Note #1: All backgrinding and thinning temporary materials are free of silicones or siloxanes.
Note #2: Anti-static versions are available for all UV, heat or peel release temporary bonding.

Made-In-USA Wafer Back Grinding and Substrate Tape Adhesives For Worldwide Applications

AIT high temperature back-grinding tape adhesives are unique in the industry for maintaining consistent bond strength to wafer at temperatures as high as 200°C. Both UV-releasing type and high temperature controlled peel strength types are available for optimizing specific applications.

Grinding Dicing Bonding Process

High Temperature Grinding Tape Adhesives with Controlled Release

Anti-static, controlled peel strength adhesive tapes for up to 300°C intermittent use

Major Distinguishing Characteristics:

  1. Can be used intermittently for up to 250°C and under some specific strong etching solutions.
  2. Absolutely silicone-free and 0% contamination transfer before and after dicing operation.
  3. Holding on diced parts even after prolonged exposure to and immersion in water.
  4. Same peel strength before and after transportation after more than 30 days of mounting.
  5. Inherently anti-static, independent of ambient moisture conditions.
  6. Tight tolerance of controlled release within 25% of peel strength specification for controlled manufacturing.
  7. 150 micron and 300 micron adhesive-compliant layer to accommodate gold-bumped and solder-bumped wafers for accurate and stress-free thinning.
AIT Product Adhesion Strength (Peel, gm/in) Adhesive/Buffer Thickness (Micron) Backing Material Thickness (Micron) Compressibility [ ] Tensile Strength (Kg/cm)
BG-FC-HTCR 250 (Single-Sided) 250 150 125 [>50 micron] >200
BG-SB-HTCR 500 (Single-Sided) 500 300 125 [>250 micron] >200
HTCR 250-GDS (Double-Sided) 250 150 125 [>50 micron] >200
HTCR 500-GDS (Double-Sided) 500 150 125 [>50 micron] >200

UV Activated Release Grinding Tape Adhesives

Anti-static, controlled peel strength tapes for up to 100°C intermittent use

Major Distinguishing Characteristics:

  1. Can be used intermittently for up to 100°C and under some specific strong etching solutions.
  2. Absolutely silicone-free and free of contamination transfer before and after dicing operation.
  3. Holding on diced parts even after prolonged exposure and immersion in water.
  4. Same peel strength and UV activated releasing property before and after transportation after more than 30 days of mounting.
  5. Inherently anti-static, independent of ambient moisture conditions.
  6. 150 Micron and 300 micron thick adhesive-buffer layer for gold-bumped and solder-bumped wafer thinning.
  7. Tight tolerance of controlled release within 25% of peel strength specification for controlled manufacturing.

NOTES:

  • Other thicknesses may be made to special order.
  • All of the compressible backing films based are proprietary technology, high temperature stable, and non-silicone flexible thermosetting resins.
  • Some of the adhesives may tolerate strong acid etchant.
AIT Product Adhesion Before UV Exposure (Peel, gm/in) Adhesion After UV Exposure (Peel, gm/in) Adhesive/Buffer Thickness (Micron) Backing Material Thickness (Micron) Compressibility [ ] Tensile Strength (Kg/cm) Special Characteristics
BG-FC-UVR500 500 20 150 125 [>100 micron] >200
  • Withstand 100°C continuous usage
  • Silicone-Free
BG-SB-UVR500 500 20 300 125 [>250 micron] >200
  • Withstand 100°C continuous usage
  • Silicone-Free

Melt-Bonding Wafer-Substrate Dicing Film

Major Distinguishing Characteristics:

1. Absolutely silicone-free.

2. All adhesives may be removed and free of contamination transfer after dicing operation.

3. Holding on diced parts even after prolonged exposure and immersion in water.

4. Same peel strength and removal property before and after transportation for more than 30 days after mounting.

5. Inherently anti-static, independent of ambient moisture conditions.

6. Tight tolerance of controlled release within 25% of peel strength specification for controlled manufacturing.

AIT Product Push-Off Strength (Die-Shear, psi) Max. Load Bearing Temp. (°C) “Melt-Bonding” Temperature & Lamination Process (@14-15psi)
CB7060 (Single ply melt-bonding adhesive film) >1,000 60
  • >70°C with heated roll laminator with proper “foam” support
  • >70°C with “vacuum bagging”
  • Low ionic and ease of total removal
CB7130 (Single ply melt-bonding adhesive film) >1,000 130
  • >130°C with heated roll laminator with proper “foam” support
  • >130°C with “vacuum bagging”
  • Low ionic and ease of total removal
CB7350-S (High-tack single-sided adhesive film on a temperature stable liner) >300 150 (Continuous & 300 @5 min.)
  • Mount wafer-substrate with suitable laminator or with “vacuum bagging” equipment
  • Low ionic and ease of total removal with suitable solvent
CB7350-B (High-tack double-sided adhesive film on a temperature stable liner) >300 150 (Continuous & 300 @5 min.)
  • Mount wafer-substrate with suitable laminator or with “vacuum bagging” equipment
  • Low ionic and ease of total removal with suitable solvent
CB7065 (Thermally conductive, single ply melt-bonding adhesive film) >1,000 60
  • >70°C with heated roll laminator with proper “foam” support
  • >70°C with “vacuum bagging” Low ionic and ease of total removal
CB7135 (Thermally conductive, single ply melt-bonding adhesive film) >1,000 130
  • >130°C with heated roll laminator with proper “foam” support
  • >130°C with “vacuum bagging” Low ionic and ease of total removal
TK7355-SS (High-tack single-sided adhesive film on a high thermal conductivity film liner) >300 150 (Continuous & 300 @5 min.)
  • Mount wafer-substrate with suitable laminator or with “vacuum bagging” equipment
  • Low ionic and ease of total removal with suitable solvent

Parts may be removed at temperatures same or higher than the lamination temperatures of 70°C for CB7065 and 130°C for CB7135. Follow by suitable solvents (Please consult AIT engineering for assistance) for complete dissolution cleaning. Proprietary cleaning solvent is used to remove diced parts for TK7355. Part-on-liner may be placed on a suitable wire-rack and soaked in solvent bath sequence for complete dissolution and cleaning of adhesive residue.

For a recommendation, information or assistance, please contact AIT sales and engineering:

AIT Solve My Problem

AIT technical sales and service department can also be reached at: 1-609-799-9388 or 1-800-735-5040 (EST) and Fax: 609-799-9308