Thermal Gels & Greases

COOL-GEL™ is another AIT innovation in thermal inferface materials.  COOL-GEL™ is a thermal interface gel in grease format for ease of application for critical thermal interfacing requiring high reliability without heat of provision of clips or pressure. COOL-GEL™ thermal gel dispenses like any silky thermal grease thermal interface material that will cure under device generated heat into a gel like structure. The dispensed grease form provides immediate and continual thermal interface performance with or without gelation process.

COOL-GREASE™ like COOL-SILVER G4 and COOL-GREASE ZX, measures the lowest thermal resistance among thermal interface materials that have been proven in both industrial electronics and hobbyist applications of over-clocking and do-it-yourself computers and electronics.  The lowest thermal interface resistance and thus best performing lowering of device temperature is achieved immediately upon dispensing and placement of CPU, GPU and other power devices between heatsinks. The grease is non-silicone and thus non-migrating to provide long-term performance without “drying” or “pumped-out” worry.

Purchase COOL-SILVER G4 Sample for Testing: http://www.ebay.com/itm/COOL-SILVER-G4-Thermal-Heatsink-CPU-Grease-Interface-Material-TIM-1cc-Syringe-/161276213405?pt=US_Thermal_Compounds_Supplies&hash=item258ccfb89d

COOL-GELFILM™ is another innovation that is a thermal interface gel in film format for ease of application for critical thermal interfacing requiring high reliability without heat of provision of clips or pressure. This compressible and comformable thermal interface material does not phase change but is pressure sensitive to provide immediate thermal interface performance.

Cool Gelfilm Pad

COOL-GAPFILL™ is yet another enhanced thermal gap-filling material that provides extreme thermal conductivity and thus unparalleled thermal interface resistance for board level multiple component thermal management. It is designed to provide conformability and compressibility to bridge the thermal gap of large boards and sensitive components. It is non-phase changing and non-silicone and thus will not contaminate components. One side remains dry but conformable for easy removal while the heat-sinking or heat-spreading side is pressure sensitive to provide the optimum thermal interface with low thermal impedance and thermal resistance.

Heat Sink Pad Processor

AIT invites anyone interested to make compressible phase-change materials or to use it for electronic and device applications based on its US patent 6,496,373 to contact us for licensing.

COOL-GEL™ Thermal Gel, COOL-GREASE™ Thermal Grease, COOL-GELFILM™ Compressible Thermal Film and COOL-GAPFILL™ Thermal Gap Pad

Thermal Interface Materials that Outperform

AIT offers a series of thermal interface materials with the most advanced and lowest thermal resistance gap filling pads that have the conformal and compressibility to bridge the differential spaces of multiple components to the heat spreader or heatsink.

The following are the key performance characteristics:

  • Eliminate air gap between components and heatsink
  • Conform to curvature and warp of matching surfaces
  • Soft and ease of compressibility to accomodate height differential of multiple components
  • Stress-free with outstanding mechanical shock absorbtion
  • COOL-GAPFILL™ DT series have one side dry to contact the heat generating component with the tacky PSA in contact with the heat spreading or heatsink for ease of rework
  • COOL-GAPFILL™ TT series have both side tacky PSA to both the heat generating components and the heat spreading or heatsink for lowest thermal impedance and yet retain relative ease of rework

COOL-GAPFILL™ DT and TT Series of GAP PAD THERMAL INTERFACE MATERIALS FOR BRIDGING BOARD TO HEAT SPREADER DIFFERENTIAL SPACES:

Gap Pad Thermal Interface Materials: COOL-GAPFILL DT Series

AIT Part # Thickness (mil/mm) Heat Facing Dry Interface (mil/mm) Cooling Facing PSA Interface (mil/mm) Thermal Conductivity (W/m-°K)
COOL-GAPFILL™ DT-20 20/0.50 4/0.10 16/0.40 >8
COOL-GAPFILL™ DT-40 40/1.00 4/0.10 36/0.90 >8
COOL-GAPFILL™ DT-80 80/2.00 4/0.10 76/1.90 >8

Purhcase COOL GAPFILL ™:

http://www.ebay.com/itm/COOL-GAPFILL-DT-Compressible-Conformal-Flexible-Interface-Thermal-Gap-Pad-TIM-/150803017472?pt=US_Thermal_Compounds_Supplies&hash=item231c8f6f00

Gap Pad Thermal Interface Materials: COOL-GAPFILL TT Series

AIT Part # Thickness (mil/mm) Heat Facing Dry Interface(mil/mm) Cooling Facing PSA Interface (mil/mm) Thermal Conductivity (W/m-°K)
COOL-GAPFILL™ TT-10 10/0.25 0, Both Sides PSA 10/0.25 >8
COOL-GAPFILL™ TT-20 20/0.50 0, Both Sides PSA 20/0.50 >8
COOL-GAPFILL™ TT-40 40/1.00 0, Both Sides PSA 40/1.00 >8

Electrically Insulating Thermal Gels and Greases

AIT Product Characteristics Electrical Resistivity (ohm-cm) Thermal Conductivity(watt/m-°C) Dielectric Strength (volt/mil) Die-shear (psi) Tg (°C)
COOL-GREASE® CGR7015 -Non-silicone thermal grease -Aluminum Oxide filled >1×1014 >2.0 N/A N/A Grease
COOL-GREASE® CGR7016 -Non-silicone thermal grease -Boron Nitride Filled >1×1014 >4.0 N/A N/A Grease
COOL-GREASE® CGR7013 -Non-silicone thermal grease -Modified Zinc Oxide Filled >1×1014 >4.0 N/A N/A Grease
COOL-GREASE® CGR7019-LB -Non-silicone thermal grease -Diamond Filled >1×1013 10.0 N/A N/A Grease
COOL-GEL® CGL7015 -Non-silicone thermal gel -Aluminum Oxide Filled >1×1013 >2.0 300 <300 -60
COOL-GEL® CGL7013 -Non-silicone thermal gel -Modified Zinc Oxide crystallite filled >1×1014 >4.1 300 <300 -60
COOL-GEL® CGL7019-LB -Non-silicone thermal gel -Diamond Filled >1×1014 >5.7 300 <300 -60
COOL-GEL® CGL7056-XT -Interface/Potting gel
-Boron Nitride Filled
>1×1014 >4.1 500 <300 -65
COOL-GEL® CGL7058 -Interface/Potting gel
-Aluminum Nitride Filled
>1×1014 >4.3 500 <300 -65
COOL-SILVERTM -Lowest thermal resistance -Non-silicone thermal grease Non-Conductive in Bulk >12 N/A N/A Grease

Electrically Conductive Thermal Gels and Greases

AIT Product Characteristics Electrical Resistivity (ohm-cm) Thermal Conductivity(watt/m-°C) Die-shear (psi) Tg (°C)
ELECTRO-GREASE ELGR8501 -Non-silicone thermal grease <5×10-3 >8.6 N/A Grease
ELECTRO-GREASE ELGR8517 -Non-silicone thermal grease
-Lower cost solution
<1×10-3 >6.4 N/A Grease
COOL-GREASE CGR8010-XT -Non-silicone thermal grease
-Very high thermal conductivity
<5×10-3 >12.9 N/A Grease
COOL-GEL® CGL8010-XT -Form Gel @ 800C -Ideal for Power Devices <1×10-4 >8.6 <300 Gel
COOL-GEL® CGL8013-XT -Silver Coated Copper filled
-Lower Cost option
<1×10-2 >8.6 <300 Gel
COOL-GEL® CGL8050 -Non-silicone thermal gel <1×10-4 >8.6 <300 Gel

For a recommendation, information or assistance, please contact AIT sales and engineering:

AIT Solve My Problem

AIT technical sales and service department can also be reached at: 1-609-799-9388 or 1-800-735-5040 (EST) and Fax: 609-799-9308