AIT’s Next Generation of De-Bondable Products:
All of these three adhesive solutions maintain high mechanical stability and high thermal stability for wafer processing at least up to 350ºC even in an oxidizing environment
Wafer Lamination Processes with High Tg Temporary Bonding Adhesive:
Film format temporary bonding adhesive from AIT is an improvement from standard materials. This format increases throughput by eliminating intensive film forming processing.
AIT’s WPA-LD adhesive film products may be melt-laminated with temperature from 140 to 160C. Please see the infographic below.
WPA-LD-350 is available with a film thickness of 20µm, 100µm, 200µm, and 400µm for use with any wafer or panel topography.
WPA-LD-PR-350 is available with a film thickness of 100µm, 200µm, and 400µm for use on bumped wafers and panels.
For those with a preference or setup for liquid dispensable products, WPA-LD-350-L is dispensed and b-staged to a film format.
Workflow for Debonding and Cleaning:
The debonding processes are similar to typical focused laser debonding of high Tg temporary bonding adhesive. The solvent removal of residual adhesive with the designated user-friendly solvent solution is within minutes at a temperature less than 80ºC.
Detailed High Tg Temporary Bonding Adhesives:
The following table describes the key properties and processing recommendations for WAP-LT-350 and WPA-LT-PR-350 that incorporated an additional clean peel-release interface layer.