For a copy of the AIT wafer processing & backgrinding adhesives presentation please click here

This webinar will examine standard wafer processing adhesives and processes and the improvements needed to increase throughput. The current industry standard temporary bonding adhesives for wafer processing require time intensive debonding methods and cleaning steps for both the carrier and the device wafer itself.

AI Technology, Inc. presents novel temporary bonding solutions to multiply throughput in wafer processing and backgrinding. These include clean release adhesive innovations and adhesives on disposable carrier.