AI Technology’s applications include die-attach, substrate and component attach, heatsink and heatpipe attach, gap filling thermal interfaces, flexible circuit substrate and interposers, EMI shielding sheets and gaskets, and hermetic lid seals.
AIT application engineering, sales, chemists, and material scientists are ready to serve your special needs and applications. Please inform us of your requirements using the Contact tab or click on the button below:
AIT technical sales and service department can also be reached at:
1-609-799-9388 and Fax: 609-799-9308
AIT designs and manufactures one of the most comprehensive series of film and paste adhesives and interfaces for use in microelectronics and electronic packaging
Solar Material Solutions including SOLAR-IMB™ Thermally Conductive Insulated Metal Back Sheet, SOLAR-THRU™ Encapsulation Transparent Front Sheet, and SOLAR-TAB™ Low Temperature Tabbing Interconnection
Flexible Circuit Substrate & Interposer Single-Sided and Double-Side Copper Pre-Preg