MIL-STD 883C 5011.4 Compliant

MIL-STD 883C Method 5011.4 Qualified Adhesive Products

Test Procedures: Mil-Std 883C Method 5011.4
Test Conditions: Per Specification
Tests Performed: 1989 to 1996
Acceptability: Both material characteristics and system level performances must meet requirements

AIT ProductCharacteristicsElectrical Resistivity(ohm-cm)Thermal Conductivity(watt/m-°C)Die-shearTg (°C)
ESP8350FlexibleAmbient storagedry epoxy film>1×1014>1.7>2,000-60
ME71551-component flexibleepoxy paste>1×1014>1.7>1,000-25
ME7156-NG1-component flexibleepoxy paste>1×1014>1.7>1,000-25
ME71591-component flexibleepoxy pasteDiamond filled>1×1014>11.4>1,000-25
ME84121-component rigidepoxy paste<5×10-4>7.9>2,000130
ME84561-component flexibleepoxy paste<4×10-4>7.9>1,000-20
ME8456-GE1-component flexibleepoxy paste<5×10-4>5.7>2,000-25
ME8456-001-component flexibleepoxy paste<4×10-4>12.5>1,200-20
TC8750Tacky epoxy film<5×10-4>6.4>2,4000

 

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