MIL-STD 883C 5011.4 Compliant

MIL-STD 883C Method 5011.4 Qualified Adhesive Products

Test Procedures: Mil-Std 883C Method 5011.4
Test Conditions: Per Specification
Tests Performed: 1989 to 1996
Acceptability: Both material characteristics and system level performances must meet requirements

AIT Product Characteristics Electrical Resistivity(ohm-cm) Thermal Conductivity(watt/m-°C) Die-shear Tg (°C)
ESP8350 FlexibleAmbient storagedry epoxy film >1×1014 >1.7 >2,000 -60
ME7155 1-component flexibleepoxy paste >1×1014 >1.7 >1,000 -25
ME7156-NG 1-component flexibleepoxy paste >1×1014 >1.7 >1,000 -25
ME7159 1-component flexibleepoxy pasteDiamond filled >1×1014 >11.4 >1,000 -25
ME8412 1-component rigidepoxy paste <5×10-4 >7.9 >2,000 130
ME8456 1-component flexibleepoxy paste <4×10-4 >7.9 >1,000 -20
ME8456-GE 1-component flexibleepoxy paste <5×10-4 >5.7 >2,000 -25
ME8456-00 1-component flexibleepoxy paste <4×10-4 >12.5 >1,200 -20
TC8750 Tacky epoxy film <5×10-4 >6.4 >2,400 0

 

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