Wafer Dicing Tapes

Key Features of AIT Wafer Dicing Tapes:

  • Release-on-demand by exposure to UV irradiation to enable pick up of largest of dies.
  • Low ionic impurities and doesn’t impart contamination of metal ions from adhesive.
  • Outstanding expandability to prevent contact damage to dies and wafer.
  • Controlled bond strength and hydrophobic to enable dicing under water-jet without peeling or slippage.
  • Complies with and supports the working environment of class 100 (ANSI 209b) requirements.

Functions and Benefits of AIT Dicing Tapes:

  • Two grades of peel strength (250 and 500 gm/in) for both UV releasing type and non-UV releasing types to accommodate different dicing speeds and die sizes.
  • Industry’s unique high temperature dicing tape with both flexible substrate and adhesive to withstand temperature up to 250°C for post and pre-dicing operations.
  • Suitable for dicing panels for packages, ceramics and glass components
  • Support laser cutting besides traditional blade dicing.
  • Maintains stable peel strength for 12 months in original packaging to facilitate transportation of diced wafer and panels.

Made-In-USA: UV Releasing, Pressure Sensitive and High Temperature Dicing Tapes to Serve Customers Worldwide

New Die-Attach film availability: AIT is now producing wafer die-attach film in wafer sizes up to 12-inches in combination with dicing tape in reel-to-reel format.  AIT’s made-in-the-USA DDAF and packaging presentation is similiar to Lintec, Hitachi and other Japanese suppliers.

Proven and Unparalleled Advantages:

  • Unique high temperature capability
  • Outstanding expandability and stability
  • Proven anti-static capability
  • Proven anti-chipping
  • Stable and consistent peel strength
  • Proven for the smallest and largest dies
  • Roll-to-roll presentation for highest volume dicing applications

UV-Releasing Wafer, Panel and Substrate Dicing Tape with Anti-Static Capability

AIT ProductCharacteristicsElectricalApplicable Temperatures (oC)Peel Strength(gm/inch)
UVR500
  • PO-PVC-AIT proprietary backing
  • Silicone-free
  • Stable peel strength
  • UV Releasing
  • 25 micron adhesive on 75 miron liner
Anti-static
  • Ambient to 150°C
  • Large and small dies
500
UVR250
  • PO-PVC-AIT proprietary backing
  • Silicone-free
  • Stable peel strength
  • UV Releasing
  • 25 micron adhesive on 75 miron liner
Anti-static
  • Ambient to 150°C
  • Large and small dies
250
UVR500-DS
  • PO-PVC-AIT proprietary backing
  • Silicone-free
  • Stable peel strength
  • UV Releasing
  • 25 micron adhesive on 75 miron liner
Anti-static
  • Ambient to 150°C
  • Large and small dies
500
UVR250-DS
  • PO-PVC-AIT proprietary backing
  • Silicone-free
  • Stable peel strength
  • UV Releasing
  • 25 micron adhesive on 75 miron liner
Anti-static
  • Ambient to 150°C
  • Large and small dies
250

High Temperature Wafer, Panel and Substrate Dicing Tape with Anti-Static Substrate

AIT ProductCharacteristicsElectricalApplicable Temperatures (oC)Peel Strength(gm/inch)
HTCR500
  • AIT proprietary backing
  • Silicone-free
  • Stable peel strength
  • 25 micron adhesive on 75 miron liner
Anti-static
  • Ambient to 150°C
  • Up to 300°C intermittent
500
HTCR250
  • AIT proprietary backing
  • Silicone-free
  • Stable peel strength
  • 25 micron adhesive on 75 miron liner
Anti-static
  • Ambient to 150°C
  • Up to 300°C intermittent
250
HTCR500-DS
  • AIT proprietary backing
  • Silicone-free
  • Stable peel strength
  • 25 micron adhesive on 75 miron liner
Anti-static
  • Ambient to 150°C
  • Up to 300°C intermittent
  • Tacky on both sides
500
HTCR250-DS
  • AIT proprietary backing
  • Silicone-free
  • Stable peel strength
  • 25 micron adhesive on 75 miron liner
Anti-static
  • Ambient to 150°C
  • Up to 300°C intermittent
  • Tacky on both sides
250

For a recommendation, information or assistance, please contact AIT sales and engineering:

AIT technical sales and service department can also be reached at: 1-609-799-9388 or 1-800-735-5040 (EST) and Fax: 609-799-9308