COOL-GELFILM™ SZ is a new class of thermal interface material that dispenses like a film but delivers performance characteristics similar to a thermal grease or gel. COOL-GELFILM™ SZ is a modified zinc oxide admixture, crystallite filled, electrically insulating at normal voltage, and engineered for large area and gap filling interface applications. It is designed to have high compressibility and instant flow to enhance thermal transfer from power device to heat sinks. COOL-GELFILM SZ is slightly tacky on both sides for optimum instant thermal transfer performance.
COOL-GELFILM™ SZ Thermal Pad sticks slightly to metal surfaces on both sides for ease of application. It does not adhere to the release liners that are on both sides when packaged. To apply, peal off the bottom release liner (no tab) and apply the exposed pad to the CPU. Then smooth out the pad on the CPU by gently touching the top release liner with your finger to remove any air bubbles. Finally, remove the top release liner by pulling on the white tab. Then install the CPU cooler. You can also trim the pad before installing with a sharp scissors on any edge, except for the white tab edge, for a perfect fit. COOL-GELFILM™ SZ is 1.5 x 1.5 inches square to accommodate all processor sizes and is 3 thousandths of an inch (3 mils) thick.
AI Technology has more than 25 years of experience and successes in helping military, aerospace, computer, and super-computer manufacturers with thermal compound and thermal interface materials for building some of the most reliable electronic devices and computers. AIT is now reaching out to serve the consumer PC community with it’s easy to apply COOL-GELFILM™ SZ state-of-the-art thermal interface pad.