COOL-SILVER PAD™ Thermal Pad has a measurable performance advantage in dropping the semiconductor junction temperature with the same heat-sink and CPU. It contains more than 90% silver by weight, 0% silicone, and is RoHS compliant. The thermal resistance is lower than the known “industry standard” of <0.0045°C-in2/Watt @ 0.001 inch interface layer thickness. Side by side comparison with the best known thermal interface materials for CPU applications demonstrated the superior performance of COOL-SILVER PAD™.
COOL-SILVER PAD™ TIM, unlike some of the earlier generations of silver thermal interface materials, will not separate, run, migrate, or bleed. Even though the thermal conductivity comes from the highly packed micronized pure silver particulate, it is not electrically conductive.
COOL-SILVER PAD™ Thermal Pad sticks slightly to metal surfaces on both sides for ease of application. It does not adhere to the release liners that are on both sides when packaged. To apply, peal off the bottom release liner (no tab) and apply the exposed pad to the CPU. Then smooth out the pad on the CPU by gently touching the top release liner with your finger to remove any air bubbles. Finally, remove the top release liner by pulling on the white tab. Then install the CPU cooler. You can also trim the pad before installing with a sharp scissors on any edge, except for the white tab edge, for a perfect fit. COOL-SILVER PAD™ is 1.5 x 1.5 inches square to accommodate all processor sizes and is 3 thousandths of an inch (3 mils) thick.
AI Technology has more than 25 years of experience and successes in helping military, aerospace, computer, and super-computer manufacturers with thermal compound and thermal interface materials for building some of the most reliable electronic devices and computers. AIT is now reaching out to serve the consumer PC community with it’s easy to apply COOL-SILVER PAD™ state-of-the-art thermal interface pad.