COOL-GAPFILL™ DT G4 is a new class of thermal interface material that dispenses like a thermal pad, but performs with characteristics like that of a grease or gel. It is filled with a modified oxide admixture, crystallite filled, electrically insulating at normal voltage, and engineered for large area and gap filling interface applications. It is designed to have high compressibility and instant flow to enhance thermal transfer from a power device to heat sink.
COOL-GAPFILL™ DT G4 is slightly tacky on both sides for optimum thermal transfer performance. COOL-GAPFILL™ DT G4 has a high thermal conductivity, and the low Tg adhesive imposes minimum thermal stress on bonded parts during thermal cycling or shock testing.
COOL-GAPFILL™ DT G4 is designed for thermal gap filling of GPU for Xbox360, Playstation, and other game consoles. It is also ideal for bridging the thermal gap for graphic chips and cards in laptops for Asus, Samsung, BenQ, Foxconn and other OEM.