Lid Seal Preforms

Wafer with Chip

Preform Lid-Seal Solution and Process

1. Send lid design to our sales-engineering staff.

It is most cost-effective if preforms are made in a panel or wafer with repeating devices.

2. Review and approve lid design

3. AIT manufactures B-staged adhesive preforms based on a repeating device pattern

4. Lids,panel or wafer of lids are placed onto adhesive preforms

5. Place lids with adhesive preforms onto devices

6. Cure Lids onto devices

Induce and observe flow of adhesive to cover lid perimeters

AIT preforms are typically high flow to allow you to observe the sealing of all sides

7. Excise devices

8. Test for seals and other qualities

Wafer with Chip on Top

Lid Seal Preforms & Process

AIT patent-pending solderable insulating lids and patented wafer level MEMS and optical lids solutions (US patent#6,432,253; 6,428,650; 6,409,859; 6,136,128) represent some of the most innovative solutions in lid sealing. The solderable lid seal when applied to insulating lids such as glass for optical lids, ceramic lids for large and small components, LCP (Liquid Crystal Polymers) for high performance components, and lid seals for MEMS and wafer level packaging represents the most cost-effective solution for reliability and performance:

  • The only proven polymer lid-seal solution that passes fine and gross leak tests
  • Unparalleled high temperature stability to withstand soldering at 300°C
  • Ideal for high volume component lid sealing
  • Ideal for CCD and optical devices when glass lids are used

Glass, Ceramic and LCP Lids

AIT Product Process & Characteristics Minimum Lid Width(mils) Gross Leak & Fine Leak DielectricStrength of Insulating Layer(Volt/mil)
ESP7675-HF
  • Wafer or Panel of Devices
  • B-staged high flow preforms
  • Ambient storable for 6 mos
  • Ease of Customization
  • Withstand 300°C soldering
6 Pass >1000

Conductive Lids

AIT Product Process & Characteristics Minimum Lid Width(mils) Gross Leak & Fine Leak DielectricStrength of Insulating Layer(Volt/mil)
ESP8680-HF
  • Wafer or Panel of Devices
  • B-staged high flow preforms
  • Ambient storable for 6 mos
  • Ease of Customization
  • Withstand 300°C soldering
6 Pass >1000

EMI Metal Caps and Lids

AIT Product Process & Characteristics Minimum Lid Width(mils) Bond Strength (psi) Electrical Resistivity(ohm-cm)
CB8250-E(Pressure Sensitive, Insitu-curable) Suitable for flat mating area of 250 micron or wider. Low cost pre-applied on your parts or your design. Insitu curing after bonding for bond strength at high temp. Ambient storable for 12 months min. 3 >600 5×10-4
CB8130(Instant Melt-Bonding @130°C) Suitable for flat mating area of 250 micron or wider. Low cost pre-applied on your parts or your design. Insitu curing after bonding for bond strength at high temp. Ambient storable for 12 months min. 3 >600 5×10-4
CB8133(Instant Melt-Bonding @130°C) Suitable for flat mating area of 250 micron or wider. Low cost pre-applied on your parts or your design. Insitu curing after bonding for bond strength at high temp. Ambient storable for 12 months min. 3 >600 2×10-2

For more information and recommendation assistance, please contact AIT sales and engineering:

AIT Solve My Problem

AIT technical sales and service department can also be reached at: 1-609-799-9388 or 1-800-735-5040 (EST) and Fax: 609-799-9308