Optical Transparent and Device Lid Sealing

Optical Transparent Sealing And Electronic Lid Seals

This series of advanced novel low temperature curing sealing solutions offer unparalleled moisture barrier and low stress protection to electroncis and other devices for the extreme working enviroments.

The low thermal expansion coefficient (CTE) ensures low stress interfacial bondin between the covers, lids and protective surfaces when matched against metals, ceramics and glasses. They are ideal for sealing optical devices such CMOS camera and LED lighting devices.

The tight interpenetrating network and the high glass transition of beyond 240°C formed by the cured sealing adhesives provide outstanding moisture barrier and protection against moisture even at saturating moisture and boiling water enviroments.

CMOS Device

 

AI Technology also formulated sealing solutions in the form of:

  • Thixotropic Pastes: To ensure controlled flow for confined and defined lid and cover sealing applications.
  • Low Viscosity Wicking Liquids: To ensure capillary flow capability to enable sealing large areas and difficult to apply interfaces. This engineered capillary flow property also enables filling into crevices and form self-leveling covers for optical and electronic protections.
  • Self-Leveling Sealing Preforms: To provide high volume controlled manufacturing environment for optical and electronic devices.

Electronic Lid Seals And Environmetal Seals

AIT Part # Dispensing Guidelines Curing Guidelines Tg (Glass Transition Temperature) CTE (ppm/°C) Gross & Fine Leaks
MC 7883 Dispense on covers or devices to be sealed Provide for adhesive flow during curing
  • 150°C for 30 min
  • 175°C for 3 min
  • 200°C for 6 sec
240°C 20 Pass
MC 7880 Dispense only minimal amount of the low viscosity liquid Provide for adhesive flow during curing
  • 150°C for 30 min
  • 175°C for 3 min
  • 200°C for 6 sec
240°C 30 Pass
MC 8880 Dispense on covers or devices to be sealed Provide for adhesive flow during curing
  • 150°C for 30 min
  • 175°C for 3 min
  • 200°C for 6 sec
240°C 25 Pass

 

Lid Seal Application Guidelines:

  • Dispense onto perimeter cover to be placed as seal (preferred)
  • Provide for pre-heating of devices to be sealed to prevent air expansion blow out

Optical Transparent Coating, Glop-Top And Seals

AIT Part # Dispensing Guidelines Curing Guidelines Tg (Glass Transition Temperature) CTE (ppm/°C) Gross & Fine Leaks
MC 3800 Dispense only minimal amount of the low viscosity liquid Provide for adhesive flow during curing
  • 100°C for 90 min
  • 125°C for 30 min
  • 150°C for 10 min
  • Do not cure or exposure to higher than 150°C
240°C 30 Pass
CXP 3880 Cut adhesive perform to size of cavity to be filled Provide for proper thickness to allow the perform to flow and fill the cavity
  • 100°C for 90 min
  • 125°C for 30 min
  • 150°C for 10 min
  • Do not cure or exposure to higher than 150°C
240°C 30 Pass

 

Optical Transparent Sealing Application Guidelines:

  • MC 3800 is a low viscosity liquid that is ideal for wicking into capillary to seal glass and other hard to get to interfaces. The colored liquid will change to colorless transparent thin film as outstanding moisture barrier.
  • CXP 3800 is a self-leveling film that will flow under heat to fill into cavity. Provide for pre-heating of devices to be sealed to prevent air expansion blow out.

For more information and recommendation assistance, please contact AIT sales and engineering:

AIT Solve My Problem

AIT technical sales and service department can also be reached at: 1-609-799-9388 or 1-800-735-5040 (EST) and Fax: 609-799-9308