光学透明和设备盖密封
Optical Transparent Sealing And Electronic Lid Seals
This series of advanced novel low temperature curing sealing solutions offer unparalleled moisture barrier and low stress protection to electroncis and other devices for the extreme working enviroments.
The low thermal expansion coefficient (CTE) ensures low stress interfacial bondin between the covers, lids and protective surfaces when matched against metals, ceramics and glasses. They are ideal for sealing optical devices such CMOS camera and LED lighting devices.
The tight interpenetrating network and the high glass transition of beyond 240°C formed by the cured sealing adhesives provide outstanding moisture barrier and protection against moisture even at saturating moisture and boiling water enviroments.
AI Technology also formulated sealing solutions in the form of:
- Thixotropic Pastes: To ensure controlled flow for confined and defined lid and cover sealing applications.
- Low Viscosity Wicking Liquids: To ensure capillary flow capability to enable sealing large areas and difficult to apply interfaces. This engineered capillary flow property also enables filling into crevices and form self-leveling covers for optical and electronic protections.
- Self-Leveling Sealing Preforms: To provide high volume controlled manufacturing environment for optical and electronic devices.
Electronic Lid Seals And Environmetal Seals
AI Technology部分# | Dispensing Guidelines | Curing Guidelines | Tg (Glass Transition Temperature) | CTE (ppm/°C) | Gross & Fine Leaks |
---|---|---|---|---|---|
MC 7883 | Dispense on covers or devices to be sealed Provide for adhesive flow during curing |
| 240°C | 20 | Pass |
MC 7880 | Dispense only minimal amount of the low viscosity liquid Provide for adhesive flow during curing |
| 240°C | 30 | Pass |
MC 8880 | Dispense on covers or devices to be sealed Provide for adhesive flow during curing |
| 240°C | 25 | Pass |
Lid Seal Application Guidelines:
- Dispense onto perimeter cover to be placed as seal (preferred)
- Provide for pre-heating of devices to be sealed to prevent air expansion blow out
Optical Transparent Coating, Glop-Top And Seals
AI Technology部分# | Dispensing Guidelines | Curing Guidelines | Tg (Glass Transition Temperature) | CTE (ppm/°C) | Gross & Fine Leaks |
---|---|---|---|---|---|
MC 3800 | Dispense only minimal amount of the low viscosity liquid Provide for adhesive flow during curing |
| 240°C | 30 | Pass |
CXP 3880 | Cut adhesive perform to size of cavity to be filled Provide for proper thickness to allow the perform to flow and fill the cavity |
| 240°C | 30 | Pass |
Optical Transparent Sealing Application Guidelines:
- MC 3800 is a low viscosity liquid that is ideal for wicking into capillary to seal glass and other hard to get to interfaces. The colored liquid will change to colorless transparent thin film as outstanding moisture barrier.
- CXP 3800 is a self-leveling film that will flow under heat to fill into cavity. Provide for pre-heating of devices to be sealed to prevent air expansion blow out.
欲了解更多信息和推荐帮助,请联系AI Technology销售和工程部。
AI Technology技术销售和服务部门也可以通过以下方式联系:1-609-799-9388或1-800-735-5040 (美国东部时间)和传真:609-799-9308。1-609-799-9388或1-800-735-5040(美国东部时间)和传真:609-799-9308