To achieve the highest level of ease in component soldering operations without pre-baking, AIT die-attach pastes have been engineered with a molecular structure of low moisture absorption. This low moisture absorption is reflected in the consistent bond strength under extreme moisture exposure.
With the increased usage of lead-free soldering, high temperature stability is critical. Low weight loss is engineered in AIT die-attach paste adhesives using a stable molecular structure. The following weight loss measure is a good indicator of the ability of AIT die-attach pastes to withstand higher temperature soldering operations and long-term high temperature applications.
To enhance the productivity of die-attach operations, AIT die-attach pastes for high volume applications have been designed with 100% solids without diluent or solvent. The use of fast curing agents enables the adhesive to cure rapidly. AIT die-attach pastes are ideal for in-line curing manufacturing without additional post curing.
AIT also designed a die-attach paste with long pot-life for high volume applications to ensure success in manufacturing operations.
For more information, recommendations and assistance, please contact AIT sales and engineering:
AIT technical sales and service department can also be reached at: 1-609-799-9388 or 1-800-735-5040 (EST) and Fax: 609-799-9308