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Die Attach Paste Adhesive & Underfill For Large and Small Dies
AIT offers some of the most advanced Die Attach paste adhesives engineered to improve long-term reliability, rapid inline curing, long pot-life, viscosity and thixotropic control for fast automated dispensing and manufacturing.
1. ME8412 is a rapid curing hyper-conductive die-attach paste
- Curing at 150°C within 15 minutes for wire-bonding up to 250°C
- Proven for both MIL-Std and commercial volume die-attach applications.
- Outstanding electrical and thermal conductivity with void-free and low BLT (bond-line thickness).
- Low moisture absorption and sensitivity for MSL Level 1 packaging.
- Built-in molecular flexibility for large area die-attach.
- ME8412-SLV is a stamp or pin-transfer low viscosity version.
2. ME7410-SSC is a snap-curing die-attach paste
- Snap-curing dielectric version for high volume commercial die-attaches.
- ME7415 is the rapid curing for thermally conductive dielectric die-attaches.
3. ME8630-SSC is a snap-curing conductive die-attach
- Proven curing in less than 5 minutes at 150°C and curable at 60°C.
- Proven for both MIL-Std and commercial volume die-attach applications
- Built-in molecular flexibility for large area die-attach.
Other proven representative products have a demonstrated record of more than 20 years of reliability for military and aerospace applications.
通过硅孔(STV)填充和底层填充的新型胶粘剂和应力消除材料的创新,用于先进的堆叠式芯片封装、翻转式芯片封装。
粘合剂和底层填充物需要特殊的工程设计,在25-100微米的缝隙中,通过小硅孔(STV)流到薄薄薄的一层,即使是大面积的模具,也能提供应力释放。
1. UF-MC7880 is designed for flip chip underfill and filling through silicon vias operating environment
- 在40-80°C相对较低的温度下粘度较低在150°C-200°C下几秒钟内快速固化
- 低膨胀系数(CTE)为30 ppm/°C左右
- 在300℃温度下的长期稳定性
- 适用于倒装芯片的直接接触封装和热压或热熔倒装芯片封装的理想选择。
2. UF-MC7883 is designed to replace traditional moisture sensitive underfill materials:
- 在40-80°C的相对低温下的大流量
- 低膨胀系数(CTE)为19 ppm/°C左右
- 在300℃温度下的长期稳定性
导电胶粘剂 点击产品上的TDS,查看产品的TDS。
AI Technology产品 | 特征 | 电阻率(欧姆-厘米) | 导热系数(瓦特/m-°C) | 模具剪切力(psi) | Tg (℃) | 粘度/触变性指标 |
---|---|---|---|---|---|---|
EG8020 |
| <4x10-4 | >5.7 | >1,800 | 50 | 150,000(cps@0.5 rpm) |
EG8050-LV |
| <4x10-4 | >7.9 | >1,500 | -20 | 129,000(cps@ 0.5 rpm) |
EG8050 |
| <4x10-4 | >7.9 | >2,000 | -20 | 190,000(cps@0.5 rpm) |
ME8155 |
| <4x10-4 | >7.9 | >2,000 | -20 | 354,000(cps@0.5 rpm) |
ME8452-A |
| <4x10-4 | >7.9 | >2,000 | -20 | 255,000(cps@0.5 rpm) |
ME8456 |
| <4x10-4 | >7.9 | >1,000 | -20 | 130,000(cps@ 0.5 rpm) |
ME8456-00 |
| <4x10-4 | >12.5 | >1,200 | -20 | 60,000(cps@0.5 rpm) |
ME8512 |
| <4x10-4 | >7.9 | >1,200 | 50 | 15,000(cps@0.5 rpm) |
ME8550-DA |
| <1x10-3 | >7.9 | >1,000 | -55 | 40,000(cps@5 rpm) |
ME8630-DA |
| <4x10-4 | >8.6 | >2,400 | 80 | 8,000(cps@ 5 rpm) TI >4.0 |
ME8630-RC |
| <5x10-4 | >8.6 | >2,400 | 80 | 15,000(cps@ 5 rpm) TI >4.0 |
ME8650-DA |
| <4x10-4 | >3.6 | >1,900 | -40 | 8,000(cps@ 5 rpm) TI >4.0 |
ME8650-RC |
| <5x10-4 | >7.9 | >1,500 | -20/50次 | 18,000(cps@ 5 rpm) TI >4.0 |
ME8850-DA |
| <5x10-4 | >7.9 | >1,000 | -20/50未成年人 | 10,000(cps@5 rpm) |
MC8880 |
| <5x10-2 | >9 | >2,500 | 240 | 65,000(cps@5 rpm) |
非导电胶粘剂
AI Technology产品 | 特征 | Electrical Resistivity(ohm-cm) | 导热系数(瓦特/m-°C) | 模具剪切力 (psi) | Tg (℃) | Viscosity |
---|---|---|---|---|---|---|
EG7655 |
| >1x1014 | >1.7 | >1,800 | -20 | 300,000(cps@0.5 rpm) |
EG7658 |
| >1x1014 | >3.67 | >1,800 | -25 | 337,000(cps@0.5 rpm) |
ME7155 |
| >1x1014 | >1.7 | >1,800 | -25 | 275,000(cps@0.5 rpm) |
ME7155-AN |
| >1x1014 | >3.6 | >1,800 | -25 | 245,000(cps@ 0.5 rpm) |
ME7156 |
| >1x1014 | >1.7 | >2,400 | -25 | 144,000(cps@0.5 rpm) |
ME7158 |
| >1x1014 | >3.6 | >1,800 | -25 | 250,000(cps@0.5 rpm) |
ME7159 |
| >1x1014 | >11.4 | >1,800 | -25 | 310,000(cps@0.5 rpm) |
ME7635-RC |
| >1x1014 | >1.2 | >3,200 | 60 | 38,000(cps@ 5 rpm) TI >3.0 |
ME7655-RC |
| >1x1014 | >0.86 | >1,200 | -25 | 50,000(cps@ 5 rpm) TI >3.0 |
ME7656 |
| >1x1014 | >3.6 | >1,200 | -10 | 200,000(cps@0.5 rpm) |
ME7665-DA |
| >1x1014 | >1.7 | >2,000 | 80 | 20,000(cps@5 rpm) |
ME7857-SC |
| >1x1013 | >2.9 | >1,500 | -60 | 60,000(cps@5 rpm) |
ME7863 |
| NA | >1.0 | >2,500 | 240 | 65,000(cps@5 rpm) |
AI Technology还提供许多其他未显示在我们网站上的模贴胶粘剂。请访问产品申请表,以获得我们办公室为您的具体应用推荐。