Description
PRIMA-BOND™ (EG7658) is a reworkable, aluminum nitride filled, electrically insulating and thermally conductive epoxy paste adhesive. It which exhibits outstanding flexibility for bonding materials with highly mismatched CTE’s (ie., alumina to aluminum, silicon to copper). The very high thermal conductivity (3.6 W/m-ºC) and flexibility make it excellent for bonding high-powered, large area die and components.
EG7658 is the same material previously sold under Laird part number TCE-004.
