COOL-GUMPAD™ CGP7156 is a new class of thermal interface gap-filler material that dispenses like a thermal pad, but performs with characteristics like a grease or gel when device temperatures increase to over 45°C. It has a compressibility of up to 3 times its original thickness to fill in all uneven thermal interface surfaces. COOL-GUMPAD™ applications include LED luminaire modules, large area power modules, and large area metal-core printed wiring board (MCPWB).
COOL-GUMPAD™ CGP7156 is optimized to accommodate large areas with different heights and gaps of less than 3-mil along its interfacing area. It is filled with a modified boron nitride admixture and is electrically insulating at normal voltage. It is designed to have high compressibility in comparison to traditional thermal pads. Once the device temperature reaches 45°C, COOL-GUMPAD™ will “melt-flow” to fill even the smallest of trapped air along the interface between the device and heat-sink or heat-spreader.
COOL-GUMPAD™ CGP7156 is semi-tacky on both sides for optimum thermal transfer performance. COOL-GUMPAD™ has high thermal conductivity and low Tg characteristics that impose minimum thermal stress on bonded parts during thermal cycling or shock testing. It is designed for thermal interface applications to withstand the worst of temperature and moisture exposure in outdoor LED luminaire applications. Of course, COOL-GUMPAD™ works great for large area power modules, power converters for solar panels, and metal core printed circuit boards populated with components that have substantial height differences.