AI Technology, Inc. Application Assistance Form (Internal)

MM slash DD slash YYYY

I. Customer:

II. Application:

Die-Component Attach:
Please Check Applicable Boxes:
Substrate-Module Attach:
Please Check Applicable Boxes:
Underfill:
Please Check Applicable Boxes:
Glob-Top Encapsulation-Potting:
Thermal Interface Pad-Tape-Film:
Thermal Interface Grease-Paste:
Conformal Coating (Flexible Dielectric):
EMI Shielding Conductive Coating (Flexible):
UV & Moisture/Corrosion Barrier Coating:
Lid Seal:
Please Check Applicable Boxes:
Sealant (Moisture & Water Resistant):
Back Grinding Tape (Wafer/Substrate Thinning):
Dicing Tape:
Back Grinding Wax & Masking:
Temporary Bonding Adhesive for Wafer, etc.:
Build Up Film:
Copper Thickness:
Moldable Encapsulation:
Flexible PWB:
Copper Thickness:
Insulated Metal Substrate:

III. Dispensing:

Needle Dispensing:
Screen or Stenciling:
Film (Preform Sheet/Roll):

IV. Bonding & Curing Conditions:

Unit of Temp:
Unit of Pressure:

Check if Applicable:

V. Reliability & Technical Considerations:

Electrical Conductivity/Insulation:
Thermal Conductivity/Insulation:
Others (Check all Applicable Boxes):