AI Technology, Inc. Application Assistance Form (Internal)Requested by:Date: MM slash DD slash YYYY Source:I. Customer:Company:Name of Contact:Title of Contact:Address:Telephone:Email: II. Application:Die-Component Attach: Paste FilmPlease Check Applicable Boxes: Thermally Conductive Thermally Insulating Die Level Wafer level DDAFSubstrate-Module Attach: Paste FilmPlease Check Applicable Boxes: C4 Flip Chip Micro-Bump Flip Chip BGAUnderfill: Paste FilmPlease Check Applicable Boxes: Electrically Conductive Insulating High ThermalGlob-Top Encapsulation-Potting: Wire-Bond Glob-Top Glob-Top with Dam Multi-Component PottingThermal Interface Pad-Tape-Film: Compressible Phase-Change Gap-Filling Pad Thermal PSA Dry FilmThermal Interface Grease-Paste: Grease Gel-Forming Electro-Grease Thermal Adhesive PasteConformal Coating (Flexible Dielectric): Moisture/Water Blocking Sulfur/Moisture Blocking UV BlockingEMI Shielding Conductive Coating (Flexible): Component Shielding on PWB Enclosure ShieldingUV & Moisture/Corrosion Barrier Coating: Transparency Required UV/Salt Spray Protection (Bridges/Ships/Structural)Lid Seal: Paste FilmPlease Check Applicable Boxes: Mechanical & Semi Hermetic Mechanical with EMISealant (Moisture & Water Resistant): Flexible Insulating Tough/Rigid Insulating Flexible EMI ShieldBack Grinding Tape (Wafer/Substrate Thinning): Wafer/Substrate (Flat) Wafer with Au Bumps Wafer with Solder BumpsDicing Tape: Control Peel Release UV Release Heat/Thermal ReleaseBack Grinding Wax & Masking: Liquid Wax (Spin Coating) Wax Film (IPA Soluble) Peel Release MaskingTemporary Bonding Adhesive for Wafer, etc.: Heat Sliding Laser Ablation UV Release Heat ReleasingBuild Up Film: Single-Sided Two-SidedInsulation Thickness:Copper Thickness: 1 oz. 1/2 oz. 1/4 oz.Moldable Encapsulation: Sheet/Film Liquid/PasteFlexible PWB: Single-Sided Two-SidedInsulation Thickness:Copper Thickness: 1 oz. 1/2 oz. 1/4 oz.Insulated Metal Substrate: Std. Insulated CU over AL Base Insulated CU over CU Base Flexible IMSCustom & Special (Please Specify)III. Dispensing:Needle Dispensing: Pressure/Time Needle Gauge Volumetric Needle GaugeScreen or Stenciling: Screen StencilingStencil or Emulsion Thickness:Film (Preform Sheet/Roll): Dry Tacky/PSA Preform Sheet/RollWidth, Length, ThicknessIV. Bonding & Curing Conditions:Max Cure Temp:Unit of Temp: °C °FMax Cure Time:Max Pressure (For Film Adhesive Only):Unit of Pressure: psi OtherCheck if Applicable: Fixture in Place During Curing Melt-Flow Tacking for Curing Without PressureV. Reliability & Technical Considerations:Bonding/Interface Area (Width x Length):Adherends Material (Part & Substrate):Flatness Tolerance (Width x Length):Electrical Conductivity/Insulation: Electrically Conductive Electrically Insulating Doesn't MatterThermal Conductivity/Insulation: Thermally Conductive Thermally Insulating Doesn't MatterDevice Power (Watts):Highest Operating Temperature (Degrees Centigrade):Highest Intermittent Temperature (Degrees in Centigrade, Duration in Hours):Max Temp (Degrees °C) & Tensile/Shear Load (psi):Temperature Cycling (Low & High Temps in °C, Number of Cycles):Others (Check all Applicable Boxes): NASA Outgassing Mil Std 883H/5011.5 HAST Commercial Other (Fill in Box Below)Other:Additional Requirements & Comments: