AI Technology, Inc. Application Assistance Form (Internal)Requested by:Date: MM slash DD slash YYYY Source:I. Customer:Company:Name of Contact:Title of Contact:Address:Telephone:Email: II. Application:Die-Component Attach: 粘贴 电影Please Check Applicable Boxes: 导热性 热绝缘 Die Level Wafer level DDAFSubstrate-Module Attach: 粘贴 电影Please Check Applicable Boxes: C4 Flip Chip Micro-Bump Flip Chip BGAUnderfill: 粘贴 电影Please Check Applicable Boxes: 导电性 Insulating High ThermalGlob-Top Encapsulation-Potting: 粘接线球顶 带水坝的全球通 多组份浇灌Thermal Interface Pad-Tape-Film: 可压缩相位变化 间隙填充垫 热敏PSA 干膜Thermal Interface Grease-Paste: 润滑脂 凝胶成型 电热润滑脂 热敏胶浆Conformal Coating (Flexible Dielectric): Moisture/Water Blocking Sulfur/Moisture Blocking UV BlockingEMI Shielding Conductive Coating (Flexible): PWB上的元件屏蔽 外壳屏蔽UV & Moisture/Corrosion Barrier Coating: 所需透明度 UV/Salt Spray Protection (Bridges/Ships/Structural)Lid Seal: 粘贴 电影Please Check Applicable Boxes: Mechanical & Semi Hermetic 机械式,带EMISealant (Moisture & Water Resistant): 弹性绝缘材料 Tough/Rigid Insulating 弹性EMI屏蔽器Back Grinding Tape (Wafer/Substrate Thinning): Wafer/Substrate (Flat) Wafer with Au Bumps Wafer with Solder BumpsDicing Tape: 控制脱皮 紫外线释放 Heat/Thermal ReleaseBack Grinding Wax & Masking: Liquid Wax (Spin Coating) Wax Film (IPA Soluble) 剥离遮蔽剂Temporary Bonding Adhesive for Wafer, etc.: Heat Sliding Laser Ablation 紫外线释放 Heat ReleasingBuild Up Film: Single-Sided Two-SidedInsulation Thickness:Copper Thickness: 1 oz. 1/2 oz. 1/4 oz.Moldable Encapsulation: Sheet/Film Liquid/PasteFlexible PWB: Single-Sided Two-SidedInsulation Thickness:Copper Thickness: 1 oz. 1/2 oz. 1/4 oz.Insulated Metal Substrate: 标准绝缘CU在AL底座上 保温CU在CU底座上 灵活的IMSCustom & Special (Please Specify)III. Dispensing:Needle Dispensing: Pressure/Time Needle Gauge Volumetric Needle GaugeScreen or Stenciling: Screen StencilingStencil or Emulsion Thickness:Film (Preform Sheet/Roll): Dry Tacky/PSA Preform Sheet/RollWidth, Length, ThicknessIV. Bonding & Curing Conditions:Max Cure Temp:Unit of Temp: °C °FMax Cure Time:Max Pressure (For Film Adhesive Only):Unit of Pressure: 磅礴 OtherCheck if Applicable: Fixture in Place During Curing Melt-Flow Tacking for Curing Without PressureV. Reliability & Technical Considerations:Bonding/Interface Area (Width x Length):Adherends Material (Part & Substrate):Flatness Tolerance (Width x Length):Electrical Conductivity/Insulation: 导电性 电绝缘 Doesn't MatterThermal Conductivity/Insulation: 导热性 热绝缘 Doesn't MatterDevice Power (Watts):Highest Operating Temperature (Degrees Centigrade):Highest Intermittent Temperature (Degrees in Centigrade, Duration in Hours):Max Temp (Degrees °C) & Tensile/Shear Load (psi):Temperature Cycling (Low & High Temps in °C, Number of Cycles):Others (Check all Applicable Boxes): NASA Outgassing Mil Std 883H/5011.5 HAST Commercial Other (Fill in Box Below)其他:Additional Requirements & Comments: