Preform Lid-Seal Solution and Process
1. Send lid design to our sales-engineering staff
◊ It is most cost-effective if preforms are made in a panel or wafer with repeating devices
2. Review and approve lid design
3. AIT manufactures B-staged adhesive preforms based on a repeating device pattern
4. Lids,panel or wafer of lids are placed onto adhesive preforms
5. Place lids with adhesive preforms onto devices
6. Cure Lids onto devices
◊ Induce and observe flow of adhesive to cover lid perimeters
◊ AIT preforms are typically high flow to allow you to observe the sealing of all sides
7. Excise devices
8. Test for seals and other qualities
Lid Seal Preforms & Process
AIT patent-pending solderable insulating lids and patented wafer level MEMS and optical lids solutions (US patent#6,432,253; 6,428,650; 6,409,859; 6,136,128) represent some of the most innovative solutions in lid sealing. The solderable lid seal when applied to insulating lids such as glass for optical lids, ceramic lids for large and small components, LCP (Liquid Crystal Polymers) for high performance components, and lid seals for MEMS and wafer level packaging represents the most cost-effective solution for reliability and performance:
◊ The only proven polymer lid-seal solution that passes fine and gross leak tests.
◊ Unparalleled high temperature stability to withstand soldering at 300°C.
◊ Ideal for high volume component lid sealing.
◊ Ideal for CCD and optical devices when glass lids are used.
|
AIT Product
|
Process & Characteristics
|
Minimum Lid Width
(mils) |
Gross Leak
&
Fine Leak
|
Dielectric
Strength of Insulating Layer (Volt/mil) |
|
|
-Wafer or Panel of Devices
-B-staged high flow preforms
-Ambient storable for 6 mos
-Ease of Customization-Withstand 300oC soldering
|
6 |
Pass |
>1000 |
|
AIT Product
|
Process & Characteristics
|
Minimum Lid Width
(mils) |
Gross Leak
&
Fine Leak
|
Dielectric
Strength of Insulating Layer (Volt/mil) |
|
|
-Wafer or Panel of Devices
-B-staged high flow preforms
-Ambient storable for 6 mos
-Ease of Customization-Withstand 300oC soldering
|
6 |
Pass |
>1000 |
|
AIT Product
|
Process & Characteristics
|
Minimum Lid Width
(mils) |
Bond Strength
(psi)
|
Electrical Resistivity
(ohm-cm) |
|
(Pressure Sensitive,
Insitu-curable)
|
Þ Suitable for flat mating area of 250 micron or wider
Þ Low cost pre-applied on your parts or your design
Þ Insitu curing after bonding for bond strength at high temp. Þ Ambient storable for 12 months min.
|
3 |
>600 |
5x10-4 |
|
(Instant Melt-Bonding
@130°C)
|
Þ Suitable for contour and flat area of 250 micron or wider
Þ Low cost pre-applied on your parts or your design
Þ Low melt-bonding and rework temperature @ 130°C Þ Ambient storable for 12 months min.
|
3 |
>600 |
5x10-4 |
|
(Instant Melt-Bonding
@130°C)
|
Þ Suitable for contour and flat area of 250 micron or wider
Þ Low cost pre-applied on your parts or your design
Þ Maintain bonding up to @ 130°C Þ Ambient storable for 12 months min.
|
3 |
>600 |
2x10-2 |
Previous page: Lid Seal Solutions
Next page: Solderable Insulating Lids