You are here: Home » Products & Solutions » Flexible and Advanced Circuit Substrate Materials » Advanced Circuit Substrate Materials
Print This Page

 

AIT COUPLER™-MIP Solderable Copper Clad Laminate

Advantages and benefits of AIT COUPLER™-MIP organic copper-clad laminate for high performance advanced chip and board level circuit 
    - Much lower dielectric constant (permittivity) and loss than polyimide and comparable to PTFE. 
    - Much lower substrate cost than PTFE (as much as 10 times lower) in and easier to fabricate multi-layer board with consistency. 
    - Consistent and lower CTE along XY and Z-axis for lower stresses and long-term thermal cycling and shock reliability
    - Highest continuous operating temperatures of >230°C. 
    - 100 times lower moisture absorption eliminates all “measling and “pop-corn” effects common with polyimide-based components and boards.

Multi-layer circuit fabrication using AIT COUPLER™-MIP organic copper-clad laminate advanced circuit substrate material 
    1. Pattern circuits of each layer with suitable fiducial marks on COUPLER™-MIP organic copper-clad laminate substrate material from ¼, ½ or 1 oz copper.
    2. Etched circuit traces of different layers according to design using traditional imaging and chemical processes.
    3. Pre-drill or cut all vias for each layer whenever appropriate. 
    4. Laminate the different layers together at temperature of 260-300°C using the fiducial marks. 
    5. Finishing drilling of pre-drill vias and drill any remaining or other blind vias through to the proper layers if required.
    6. Plate blind vias using traditional process.
    7. Finish imaging, etching of outer layers. 
    8. Cut, inspect and test finished boards or interposes.      

APPLICATIONS
       o      High Frequency and microwave circuit (PTFE replacement).
o      High speed chip interposer substrate.
o      High performance flexible circuit substrate (Polyimide copper clad replacement).
o      High performance multi-layer chip and board substrate material.

 

 
FEATURES
o      High dimensional stable flexible circuit substrate material.
o      Multi-layer lamination at 260ºC or above.
o      Directly solderable up to 250ºC.
o      Properties are similar to standard Polyimide with dramatically lower moisture absorption.
o      Copper cladding is achieved without additional adhesive layer.

o      UV solder mask may be applied simultaneously to increase yields.

 

 

AVAILABILITY
o      1 oz copper on 2 mils dielectric (COUPLERTM-MIP-36).
o      1/2 oz copper on 2 mils dielectric (COUPLERTM-MIP-18).
o      1/4 oz copper on 2 mils dielectric (COUPLERTM-MIP-09).
 
 
 

 

Characteristics
FR-4
PTFE
Polyimide
COUPLER™-MIP
Volume Resistivity (MΩ-cm)
 
1X108
0.1X108
1000X108
10X108
Density (g/cc)
 
1.2
2.2
1.4
1.4
Permittivity @ 1MHz - 1GHz
 
4.4
2.6-4.0
4.1
2.9
Loss Tangent @ 1MHz – 1GHz
 
0.018
0.001
0.006
0.002
Dielectric Breakdown (V/Micron)
 
100
240
276
220
Moisture Absorption (%)
 
1.0-1.5
0.02
1.0-2.0
0.02
Flammability (UL-94)
 
V0
V0
V0
V0
Tensile Strength (MPa)
 
63
22
231
208
Thermal Conductivity (W/m/ºK)
 
0.2
0.3
0.12
0.3
Continuous Service Temperature (ºC)
 
>100
>200
>200
>230
Degradation Temperature (ºC)
 
290
>300
>300
>350
Coefficient of Thermal Expansion
X-Y Axis below Tg
20
12
20
12
Z-axis below Tg
60
12
20
12
Glass Transition Temperature (ºC)
134-178
Not defined
(Low)
250
>220
Relative Cost
1
4
4-100
4

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

AIT COUPLER™-MIP organic copper-clad laminate substrate and pre-preg material can panels can be used to build one of the thinnest components and circuit boards with 40-50 micron dielectric over 1/4 oz (9 micron) copper conductor.  

 

AIT, solve my problem!

 

 

 

 

 

 

 


^ Top

Previous page: Low Pressure Copper Pre-Preg
Next page: Lid Seal Solutions