COUPLERTM is a novel organic copper-clad laminate that is available with 40-50 micron molecularly flexible dielectric and as thin 1/4 oz copper layer for ultra-thin components and boards.
AIT patented (US patent#7,154,046; 6,717,819; 6,580,035; 6,581,276; 6,108,210; 6,297,564; 6,665,193; 6,973,716)) flexible circuit substrates (FCS) are organic copper-clad lamiante that differs from traditional FCS in two fundamental aspects to give them the unparalleled reliability performance:
◊ Instead of polyimide-adhesive or vacuum deposited copper laminates, its uses AIT proprietary flexible hydrophic dielectric insulating layer resulting in stress-free and high speed circuits and interconnections.
◊ Unparalleled high temperature stability to withstand soldering at 300°C.
◊ Multi-layer capability with the same flexible dielectric copper pre-preg that can be laminate at low pressure of less than 14 psi and 125°C or higher.
◊ Thinner pre-preg are available in rolls of 24-inch width.
◊ Thicker pre-preg are available in sheets of 24-inch by 24-inch.
◊ Ideal for flexible circuits, fine-pitch interposers, power and LED components, modules.
Flexible Pre-Preg for Flex Circuits and Interposers
|
AIT
Product
|
Characteristics
|
Copper Thickness
(oz) |
Dielectric Thickness(mils)
|
Nominal Stack Thickness
(mils)
|
Dielectric
Strength of Insulating Layer (Volt/mil) |
Dielectric Constant of Insulating Layer
|
|
COUPLERTM |
-Flexible Dielectric
-Lamination Flow @>125oC
and <14 psi
-Withstand 300oC soldering
|
1 |
2 |
3.5 |
>1000 |
3.1 |
|
COUPLERTM |
-Flexible Dielectric
-Lamination Flow @>125oC
and <14 psi
-Withstand 300oC soldering
|
1/2 |
2 |
2.75 |
>1000 |
3.1 |
|
COUPERTM |
-Flexible Dielectric
-Lamination Flow @>125oC
and <14 psi
-Withstand 300oC soldering
|
1/4 |
2 |
2.38 |
>1000 |
3.1 |
Flexible Pre-Preg for Power and LED Modules
|
AIT Product
|
Characteristics
|
Copper Thickness
(oz) |
Thermal
Resistance(oC/W-in2) |
Nominal Stack Thickness
(mils)
|
Dielectric
Strength of Insulating Layer (Volt/mil) |
Dielectric Constant of Insulating Layer
|
|
COUPLERTM |
-Flexible thermal dielectric
-Lamination Flow @>125oC
and <14 psi
-Withstand 300oC soldering
|
1 |
<1.1 |
88 |
>1000 |
4.5 |
|
COUPLERTM |
-Flexible thermal dielectric
-Lamination Flow @>125oC
and <14 psi
-Withstand 300oC soldering
|
2 |
<1.1 |
115 |
>1000 |
4.5 |
|
COUPERTM |
-Flexible thermal dielectric
-Lamination Flow @>125oC
and <14 psi
-Withstand 300oC soldering
|
Custom |
<1.1 |
Custom |
>1000 |
4.5 |
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