AI Technology is the only US company that manufactures dicing and back grinding tapes in an ISO 9001-2008 facilities, located in Princeton, NJ.
除了UV释放型和压敏型的切割和研磨胶带，其性能与日本制造的同类产品相似，甚至不相上下之外，AI Technology还开创了一种独特的高温稳定的切割和研磨胶带，适用于更严格的应用。
Back Grinding tapes and wafer thinning thermal grease-adhesive
Dicing tapes that are compatible with all industrial standard processes and equipment
- High Temperature Back Grinding Tapes
- UV Releasing Back Grinding Tapes
- Vacuum wafer thinning thermal grease-adhesives
广泛的AIT可逆临时键合解决方案是专门为化合物半导体的加工而设计的，通常需要对加工后的晶圆进行背面减薄或背面光刻。GaAs、InP、SiC和其他化合物的晶圆价格昂贵，机械性能相对较差。
AIT的可逆键合蜡膜和旋涂解决方案也是载体或子母基材背面减薄和背面光刻加工的理想选择。这些载体或子贴装基板通常是蓝宝石、石英、玻璃，或在某些情况下是硅晶片。
Made-In-USA: Dicing For Wafer Dicing And Back Grinding Tapes And Grease-Adhesive For Wafer Thinning Applications
AIT是唯一一家能够承受高温暴露的切丁带制造商。这种独特的耐高温能力通过独特的抗静电高拉伸基材得到进一步增强。此外，还提供具有不同剥离强度的紫外线释放版本。
The success of dicing tape is proven with 100% yield without die loss during the dicing process.
如需推荐、信息或帮助，请联系AI Technology销售和工程部。
AIT technical sales and service department can also be reached at: 1-609-799-9388 and Fax: 609-799-9308