AI Technology is the only US company that manufactures its dicing and back grinding tapes in its ISO 9001-2008 facilities in Princeton, NJ.
Besides the UV releasing and pressure sensitive types of dicing and grinding tapes that are proven with performance similar to many of the Japanese manufacturers for products with the same applications, AIT pioneers the unique high temperature stable dicing and grinding tapes for more stringent applications.
Back Grinding tapes and wafer thinning thermal grease-adhesive
Dicing tapes that are compatible with all industrial standard process and equipment
- High Temperature Back Grinding Tapes
- UV Releasing Back Grinding Tapes
- Vacuum wafer thining thermal grease-adhesives
For more information and recommendation assistance, please contact AIT sales and engineering:
AIT technical sales and service department can also be reached at: 1-609-799-9388 or 1-800-735-5040 (EST) and Fax: 609-799-9308
Made-In-Usa Dicing For Wafer Dicing And Back Grinding Tapes And Grease-Adhesive For Wafer Thinning Applications
AIT is the only manufacturer of dicing tapes that can withstand high temperature exposure. This unique ability to tolerate high temperatures is further enhanced with unique anti-static highly stretchable substrate. Uv-release versions with different peel strengths are also available.
The success of dicing tape is proven with 100% yield without die loss during the dicing process.
