COOL-GELFILM™ is another innovation that is a thermal interface gel in the film format for ease of applications for critical thermal interfacing requiring high reliability without heat of provision of clips or pressure. This compressible and comformable thermal interface materials does not phase change but is pressure sensitive to provide immediate thermal interface performance.
COOL-GAPFILL™ is yet another enhanced thermal gap-filling materials that provides extreme thermal conductivity and thus unparalleled thermal interface resistance for board level multiple component thermal management. It is designed to provide conformability and compressibility to bridge the thermal gap of large boards and sensitive components. It is non-phase change and non-silicone and thus will not contaminate components. While one side remain dry but conformable for easy removal while the heat-sinking or heat-spreading side is pressure sensitive to provide the optimum thermal interface with low thermal impedance and thermal resistance.
AIT invites anyone interested to make compressible phase-change materials or to use it for electronic and device applications based on its US patent 6,496,373 to contact us for licensing.
For more information and recommendation assistance, please contact AIT sales and engineering:
AIT technical sales and service department can also be reached at: 1-609-799-9388 or 1-800-735-5040 (EST) and Fax: 609-799-9308
Phase-Change Thermal Interface Pads, Comressible Phase-Change Thermal Interface Materials, Compressible and Conformal Thermal Interface Gap Pads, and Pressure Sensitive Thermal Pads
AIT pioneered the use of phase-change materials for use as thermal interface adhesive materials for thermal management in the early 1990's. These phase change materials used as specialty adhesives found acceptance in both military and commercial electronics over the last 15 years. AIT has patented the use of "compressible phase-change" thermal interface materials and "in-situ curing" thermal interface adhesive materials with one of the lowest thermal interface resistance. This new class of compressible phase change gap-filling materials enable the filling of large gaps between heat-spreader and the heat generating components that may have substantial differential heights. The following tables represent some of these innovative gap-filling phase change interface materials and their solutions and advantages:
- Compressible phase-change interface materials that compensates for large area and extreme height tolerances and gaps.
- In-situ curing thermal interface adhesive materials that provides up to 300 psi as applied and cure to over 600-1200 psi over time at operating temperatures of the device.
- Available as electrically conductive or electrically insulating thermal adhesives, thermal greases, thermal gels and thermal pads.
- Available as dry, single-sided or double-sided pressure sensitive tacky thermal interface pads and thermal adhesives film tapes.
- Available in preforms of thermal phase change material pads and thermal adhesive films and tapes.
- Phase-change thermal interface pad materials that flow at 55°C, 90°C, 130°C, and 180°C respectively.
- Phase-change materials of all thickness with outstanding thermal conductivitity and low thermal interface resistance to help cool and manage power devices as adhesives, greases, gels and gap filling compressible thermal pads.
Electrically Insulating Compressible Phase-Change Thermal Interface Materials & In-situ Curing Thermal Interfaces Adhesives
| AIT Product | Characteristics | Electrical Resistivity (ohm-cm) | Thermal Conductivity(watt/m-°C) | Dielectric Strength (volt/mil) | Die-shear (psi) | Tg (°C) |
|---|---|---|---|---|---|---|
| COOL-BOND® CB7065 | -In-situ curing >60°C -Flexible to -55°C | >1x1014 | >2.0 | >550 | >600 | -55 |
| COOL-BOND® CB7068 | -In-situ curing >60°C -Flexible to -55°C | >1x1014 | >4.0 | >550 | >600 | -55 |
| COOL-BOND® CB7135 | -High Melt-Flow >135°C -Flexible to -55°C | >1x1014 | >2.0 | >550 | >800 | -55 |
| COOL-BOND® CB7138 | -High Melt-Flow >135°C -Flexible to -55°C | >1x1014 | 4.0 | >550 | >600 | -55 |
| COOL-BOND® CB7208-A | -In-situ curing -Pressure Sensitive | >1x1014 | 3.6 | 750 | >600 | -25 |
| COOL-BOND® CB7208-EDA | -In-situ curing >60°C -100 psi die-shear as applied | >1x1014 | >3.6 | 750 | >600 | -25 |
| COOL-BOND® CB7205-E | -In-situ curing >60°C -50 psi die-shear as applied | >1x1014 | >1.9 | 750 | >300 | -25 |
| COOL-PAD™ CPR7158 | -Non-curing -compressible phase-change pad | >1x1014 | >3.0 | 550 | NA | -45 |
| COOL-PAD™ CPR7155 | -Non-curing -compressible phase-change pad | >1x1014 | >2.0 | 550 | >600 | -45 |
| COOL-PAD™ CP7065-KP | -Melt-Flow @ 65°C -Power Device to Heat-sink | >1x1014 | 2.0 | >6000 | NA | -55 |
| COOL-PAD™ CP7066 | -Melt-Flow @ 50°C -Low Bond Strength | >1x1014 | 4.0 | 550 | <100 | -55 |
| COOL-PAD™ CP7068 | -Melt-Flow @ >70°C -Aluminum Nitride filled Dry Film | >1x1014 | 4.0 | >550 | <300 | -55 |
| COOL-PAD™ CP7108 | -High Melt-Flow @ >135°C -Aluminum Nitride filled Dry Film | >1x1014 | >4.0 | >550 | <900 | -55 |
| COOL-PAD™ CP7135 | -High Melt-Flow @ >135°C -Aluminum Oxide filled Dry Film | >1x1014 | 2.0 | >550 | >800 | -55 |
| COOL-PAD™ CP7135-KP | -High Melt-Flow @ >135°C -Kapton lined | >1x1014 | 2.0 | >5000 | >800 | -55 |
| COOL-PAD™ CP7138 | -High Melt-Flow @ >150°C -Aluminum Nitride filled Dry Film | >1x1014 | 4.0 | >550 | >700 | -55 |
| COOL-PAD™ CP7138-2KP | -High Melt-Flow @ >135°C -Kapton lined | >1x1014 | 4.0 | >3000 | >800 | -55 |
| COOL-PAD™ CP7175 | -Puncture Resistant Pad ->1500V Insulation @ 3 mil -Polyimide laminates availible | >1x1014 | 1.8 | >750 | NA | -55 |
| COOL-PAD™ CP7178 | -Non-curing -Non-flowing -Thermal gasket pad -Polyimide laminates availible | >1x1014 | >3.0 | 550 | NA | -45 |
| COOL-PAD™ CP7505 | -Melt-Flow @ 55°C -Aluminum Oxide Filled Dry Pad | >1x1014 | 1.8 | >550 | <40 | -55 |
| COOL-PAD™ CP7506-HFT | -High Flow @ 50°C -One side Tacky film | >1x1014 | 4.0 | >550 | <100 | -55 |
AIT offers many other phase change materials and non-phase change materials for use as thermally conductive materials that may not shown on our web site. Please go to Product Application Form to receive a recommendation from our office on your specific application.
Electrically Conductive Compressible Phase-Change Thermal Interface Materials & In-situ Curing Thermal Interface Adhesives
| AIT Product | Characteristics | Electrical Resistivity (ohm-cm) | Thermal Conductivity(watt/m-°C) | Die-shear (psi) | Tg (°C) |
|---|---|---|---|---|---|
| COOL-BOND® CB8130 | -High Melt-Flow -Dry film for easy handling | <4x10-4 | >7.9 | >400 | -55 |
| COOL-BOND® CB8130-XT | -Extra-High Thermal Conductivity -Extra-High Electrical Conductivity | <2x10-4 | >16 | >400 | -55 |
| COOL-BOND® CB8133 | -Silver Plated Copper Filled -Lower cost solution | <5x10-3 | >8 | >800 | -55 |
| COOL-BOND® CB8205-EJD | -In-situ curing >60°C -300 psi die-shear bond strength as applied | <5x10-3 | >5.7 | >600 | -25 |
| COOL-BOND® CB8250-E | -Pressure Sensitive, Cross-linkable -Improved Bond Strength | <5x10-3 | >3.6 | >1000 | -55 |
| COOL-PAD™ CP8550 | -Phase change -dry pad | <4x10-4 | >9.0 | >100 | -55 |
| COOL-PAD™ CP8550-HF | -Phase change -dry pad -High flow | <4x10-4 | >9.0 | >100 | -55 |
| COOL-PAD™ CP8550-HFT | -Electrical & thermal -ground plane interface | <4x10-4 | >9.0 | >100 | -60 |
| COOL-PAD™ CPR8850 | -Non-curing -compressible phase-change pad | <5x10-4 | >9.4 | N/A | -60 |
| COOL-PAD™ CPR8850-XT | -Non-curing -compressible phase-change pad | <5x10-4 | >9.4 | N/A | -60 |
| COOL-PAD™ CPR8853 | -Non-curing -compressible phase-change pad | <5x10-3 | >9.4 | N/A | -60 |
AIT offers many other phase change materials that are electrically and/or thermally conductive interface materials not shown on our web site. Please go to Product Application Form to receive a recommendation from our office on your specific application.
