Substrate Attach Film Adhesives

AIT flexible film adhesives for substrate attach include the following:

  • Dry epoxy film adhesives
  • Tacky pressure sensitive epoxy film adhesives
  • Thermally conductive insulating film and paste adhesives
  • Electrically conductive film and paste adhesives
  • Molecularly flexible stress free bonding

AIT Products

AIT die-cutting services:

  • Rotary die-cutting for large volume
  • Laser die-cutting for special shape and sizes
  • Programmable machine die-cutting for precision parts
  • Steel rule die for thick parts

Circuit Board

For more information and recommendation assistance, please contact AIT sales and engineering:

AIT Solve My Problem

AIT technical sales and service department can also be reached at: 1-609-799-9388 or 1-800-735-5040 (EST) and Fax: 609-799-9308

 

Flexible Film Adhesive For Reliable Substrate And Component Attach

AIT pioneered the use of flexible substrate-attach film adhesives since 1985. Its flag-ship products such as TC8750 and ESP8450-WL have found many successful applications for over the last 20 years. Continuing with this innovative heritage, the following "Substrate and Component Attach Film" adhesives represents products that are engineered for both manufacturability and reliability:

Molecular flexible for stress-free bonding for large area substrate and component

  • All specialty film adhesives are available in dry tack-free or tacky pressure sensitive formats for large and low volume manufacturing
  • Ability to withstand 250°C exposure such as wire-bonding
  • Low moisture absorption for ultimate reliability
  • "Instant melt-bondable" thermoplastic substrate-attach films Electrically Conductive Film Adhesives

Electrically Conductive Film Adhesives

AIT ProductCharacteristicsElectrical Resistivity (ohm-cm)Thermal Conductivity (watt/m-°C)Die-shear (psi)Tg (°C)Film Type
ESP8450-WL
  • Instant melt-tack >120°C (<10 psi)
  • Curing without fixture and pressure
  • Withstand >150°C wire-bonding
  • Low moisture absorption
  • Proven reliability for large area bonding
<4x10-4 >6.0 >1,500 -45 Tack free dry film Preforms 3-12 mils (thick)
ESP8550
  • Instant melt-tack >120°C (<10 psi)
  • Curing without fixture and pressure
  • Withstand >150°C wire-bonding
  • Low moisture absorption
  • Proven reliability for large area bonding
<1x10-4 >6.0 >1,500 -50 Tack free dry film Preforms 3-12 mils (thick)
TP8550
  • Instant melt-bond >160°C (<10 psi)
  • No post curing
  • Withstand >150°C wire-bonding
  • Low moisture absorption
  • Meets MIL-STD-883 5011.4
<4x10-4 >6.0 >1,500 -40 Tack free dry film Preforms 3-12 mils (thick)
RTC8750
  • Tacky for instant placement without fixture
  • Ambient storable for 6 months
  • Curing with fixture or low pressure
  • Withstand high temperature excursion
  • Molecularly flexible for low interfacial stress
  • Proven reliability for large area substrates
<4x10-4 >6.0 >1,500 -45 Tacky film Preforms 3-12 mils (thick)
TC8750
  • Tacky for instant placement without fixture
  • Curing with fixture or low pressure -Withstand high temperature excursion
  • Molecularly flexible for low interfacial stress
  • Meets MIL-STD-883 5011.4
  • Passes NASA outgassing requirements
  • Proven reliability for large area substrates
<4x10-4 >8.0 >1,500 -20 Tacky film Preforms 3-12 mils (thick)

Electrically Non-conductive Film Adhesives

AIT ProductCharacteristicsElectrical Resistivity (ohm-cm)Thermal Conductivity (watt/m-°C)Die-shear (psi)Tg (°C)Film Type
TK7758
  • Tacky for instant placement without fixture
  • Curing with fixture or low pressure
  • Withstand high temperature excursion
  • Molecularly flexible for low interfacial stress
  • Proven reliability for large area substrates
>1x1014 >3.6 >1,500 -20 Tacky film Preforms 3-12 mils (thick)
ESP7455
  • Instant melt-tack >120°C (<10 psi)
  • Curing without fixture and pressure
  • Withstand >300°C short-term exposure
  • Low moisture absorption
  • Proven reliability for large area substrates
>1x1014 >2.0 >1,500 -45 Tack free dry film Preforms 3-12 mils (thick)
RTK7556
  • Instant melt-tack >80°C (<10 psi)
  • Curing without fixture and pressure
  • Withstand >250°C wire-bonding
  • Low moisture absorption
  • Proven reliability for large area substrates
>1x1014 >3.0 >1,500 -45 Tacky film Preforms 3-12 mils (thick)
TP7155
  • Instant melt-bond >190°C (<10 psi)
  • No post curing
  • Withstand >150°C wire-bonding
  • Low moisture absorption
>1x1 >2.0 >1,500 -40 Tack free dry film Preforms 3-12 mils (thick)

AIT offers many other Substrate Attach film materials not shown on our web site. Please go to Product Application Form to receive a recommendation from our office on your specific application. Electrically Non-conductive Film Adhesives