AIT pioneered the use of flexible substrate-attach film adhesives since 1985. Its flag-ship products such as TC8750 and ESP8450-WL have found many successful applications for over the last 20 years. Continuing with this innovative heritage, the following "Substrate and Component Attach Film" adhesives represents products that are engineered for both manufacturability and reliability:
· Molecular flexible for stress-free bonding for large area substrate and component
· All specialty film adhesives are available in dry tack-free or tacky pressure sensitive formats for large and low volume manufacturing
· Ability to withstand 250°C exposure such as wire-bonding
· Low moisture absorption for ultimate reliability
· “Instant melt-bondable” thermoplastic substrate-attach films
Click on the Product for the TDS
Electrically Conductive Film Adhesives
|
AIT
Product
|
Characteristics
|
Electrical
Resistivity
(ohm-cm)
|
Thermal
Conductivity
(watt/m-oC)
|
Die-shear
(psi)
|
Tg
(oC)
|
Film
Type
|
|
-Instant melt-tack >120°C (<10 psi)
-Curing without fixture and pressure -Withstand >150°C wire-bonding
-Low moisture absorption
-Meets MIL-STD-883 5011.4
-Proven reliability for large area bonding
|
<4x10-4 |
>6.0 |
>1,500 |
-45 |
Tack free
dry film
Preforms
3-12 mils
(thick)
|
|
|
-Instant melt-tack >120°C (<10 psi)
-Curing without fixture and pressure -Withstand >150°C wire-bonding
-Low moisture absorption
-Meets MIL-STD-883 5011.4
-Proven reliability for large area bonding
|
<1x10-4 |
>6.0 |
>1,500 |
-50 |
Tack free
dry film
Preforms
3-12 mils
(thick)
|
|
|
TPX 8150-W
|
-Instant melt-bond >200°C (<10 psi)
-No post curing -Withstand >150°C wire-bonding
-Low moisture absorption
-Meets MIL-STD-883 5011.4
|
<4x10-4 |
>6.0 |
>1,500
|
-40
|
Tack free
dry film
Preforms
3-12 mils
(thick)
|
|
-Tacky for instant placement without fixture
-Ambient storable for 6 months
-Curing with fixture or low pressure -Withstand high temperature excursion
-Molecularly flexible for low interfacial stress
-Meets MIL-STD-883 5011.4
-Passes NASA outgassing requirements
-Proven reliability for large area substrates
|
<4x10-4 |
>6.0 |
>1,500
|
-45
|
Tacky film
Preforms
3-12 mils
(thick)
|
|
|
-Tacky for instant placement without fixture
-Curing with fixture or low pressure -Withstand high temperature excursion
-Molecularly flexible for low interfacial stress
-Meets MIL-STD-883 5011.4
-Passes NASA outgassing requirements
-Proven reliability for large area substrates
|
<4x10-4 |
>8.0
|
>1,500 |
-20
|
Tacky film
Preforms
3-12 mils
(thick)
|
AIT offers many other Substrate Attach film materials not shown on our web site. Please go to Product Application Form to receive a recommendation from our office on your specific application.
|
AIT
Product
|
Characteristics
|
Electrical
Resistivity
(ohm-cm)
|
Thermal
Conductivity
(watt/m-oC)
|
Die-shear
(psi)
|
Tg
(oC)
|
Film
Type
|
|
-Tacky for instant placement without fixture
-Curing with fixture or low pressure -Withstand high temperature excursion
-Molecularly flexible for low interfacial stress
-Meets MIL-STD-883 5011.4
-Proven reliability for large area substrates
|
>1x1014
|
>3.6
|
>1,500
|
-20
|
Tacky film
Preforms
3-12 mils
(thick)
|
|
|
-Instant melt-tack >120°C (<10 psi)
-Curing without fixture and pressure -Withstand >300°C short-term exposure
-Low moisture absorption
-Meets MIL-STD-883 5011.4
-Passes NASA outgassing requirement
-Proven reliability for large area substrates
|
>1x1014
|
>2.0
|
>1,500 |
-45
|
Tack free
dry film
Preforms
3-12 mils
(thick)
|
|
|
-Instant melt-tack >80°C (<10 psi)
-Curing without fixture and pressure -Withstand >250°C wire-bonding
-Low moisture absorption
-Meets MIL-STD-883 5011.4
-Passes NASA outgassing requirement
-Proven reliability for large area substrates
|
>1x1014
|
>3.0
|
>1,500 |
-45
|
Tacky film
Preforms
3-12 mils
(thick)
|
|
|
TPX 7155-W
|
-Instant melt-bond >200°C (<10 psi)
-No post curing -Withstand >150°C wire-bonding
-Low moisture absorption
-Meets MIL-STD-883 5011.4
-Passes NASA outgassing requirement
|
>1x1 |
>2.0
|
>1,500
|
-40
|
Tack free
dry film
Preforms
3-12 mils
(thick)
|
AIT offers many other Substrate Attach film materials not shown on our web site. Please go to Product Application Form to receive a recommendation from our office on your specific application.
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