AIT engineered and designed several innovative lid-sealing solutions for optical, thermal, EMI and commercial component and module packaging with outanding cost effectiveness. It is ideal for the MEMS and wafer level lid sealing applications. The following are some of the examples:
Solder-Able Ceramic, Glass and LCP Lids
Pre-Applied Adhesive Preforms
EMI Shielding Covers, Lids and Caps without soldering
SNAP-LID® Adhesive Preform Pre-application
Patent pending low cost pre-application of adhesive preforms on plastic, ceramic, metal lids. Instant tacking-bonding for in-line processes for both thermoplastic and epoxy-based adhesives. AIT provides both pre-applications on your parts or provides complete solution with lids.
COOL-LID® Lid Attach to Combine with Thermal Management
A solution incorporating heat-spreading interface from a flip chip device and module to the lid cover is accomplished with an AI Technology adhesive that is pre-applied and provides for a rapid bonding lid attach.This new technology combined the now world-renown COOL-PAD™ interface solution for devices generating more than 100 watts within a square inch area along with the snap-curing adhesive preform combine to provide a winning solution for the majority of lid attachment applications. COOL-LID™ is a special cost effective patent-pending process where pre-application of thermal interface material and lid-seal adhesive are used. Lids may be constructed of copper, aluminum, and ceramics. If thermal performance is not critical, even plastic caps can be used. The B-staged lid seal adhesive and interface pad are dry to the touch and are ambient storable for 12 months. Both the adhesive and interface material will tack onto a substrate and form an intimate thermal contact at 150°C in a matter of seconds with nominal pressure of 10 psi. Full cure is achieved without pressure at 150°C in less than 5 minutes.
LID-SEAL: Low Cost Sealing, Thermal & Shielding Solutions
|
AIT Product
|
Applications
|
Resistivity
(ohm-cm)
|
Thermal Conductivity
(W/m-°C)
|
CTE
ppm/°C
|
Die-Shear
(psi)
|
Cure Schedule (temp/time) Flow Characteristics (pressure)
|
|
Adhesive Preforms(Adhesive Film Pre-application for optical, component, and module lid sealing)
|
Patented pending low cost pre-application of adhesive on metal, ceramics, optical GLASS or LCP lids. Instant tacking-bonding for in-line processes for both thermoplastic and epoxy-based adhesives. AIT provides both pre-applications on your parts or provides complete solutions with optical lids. Passes fine and gross leaks and 85%RH/85C aging without fogging or change of bond strength.
|
|||||
|
Smaller ceramic lids
Plastic lids of any size Passes gross and fine leaks
Good moisture barrier
|
>1x1014
|
1.2
|
40
|
>3,000
|
Induce flow during placement at >100°C/14psi, Full curing @150°C/5min. without pressure
Ambient storable for 12 mos.
|
|
|
Metal lids for EMI Shielding
Outstanding moisture barrier
Low Stress with Low Temp Curing
|
<5x10-4
|
>6.0
|
45
|
>2,000
|
Induce flow during placement at 80-100°C
Full Curing 80-150°C with NO pressure
Ambient storable for 12 mos.
|
|
|
Larger Lids and Devices
Outstanding moisture barrier
TP7150 for use <160°C
|
>1x1014
|
0.3
|
|
>1,200
|
Ambient storable for 12 mos.
Instant melt-bonding at >10psi >200°C
|
|
|
SOLDERLESS-EMI-Shielding with Pre-application adhesives
|
-Low cost pre-application of instant melt-bondable conductive adhesive preforms to replace soldering onto PWB.
-Instant insertion bonding with shielding effectiveness with pre-applied pressure-sensitive. Optional in-situ curing for additional strength upon heating.
-Instant tacking-bonding for in-line processes for both thermoplastic-based conductive lid shielding and sealing adhesives.
-AIT will pre-apply adhesive on your parts or provide a complete solution with metal lids and covers.
|
|||||
|
EMI Shielding Outstanding moisture barrier
Ease of reworking Highest performance
|
<5x10-4
|
>6.0
|
Flexible
|
>1,000
|
Ambient storable for 12 mos.
Instant melt-bonding at >150°C without pressure
|
|
|
CB8253-E |
EMI Shielding Outstanding moisture barrier
Ease of reworking Lowest cost solution
|
<5x10-3 |
>6.0 |
Flexible | >1,000 |
Ambient storable for 12 mos. Pressure-sensitive with additional optional in-situ curing bonding at >150°C without pressure
|
Previous page: Advanced Circuit Substrate Materials
Next page: Lid Seal Preforms