盖子和光学密封

Lid Attach Dispensible Insulating and Conductive Adhesive

AI Technology设计和设计了多种创新的盖子密封解决方案，适用于光学、热敏、电磁干扰和商业元件及模块封装，具有出色的成本效益。它是MEMS和晶圆级封盖应用的理想选择。以下是一些例子。

AI Technology produces one of the unique dispensible lid-seal adhesives that can be cured at relatively low temperature of 100-200°C and yet capable of withstanding operation temperature of beyond 300°C continuously. While not as perfect hermetic seals as metal and glass seal, the cured lid seals passed gross and fine leak tests for almost all commercial applications. It is ideal for CMOS and other optical imaging devices.

1. MC7883 Insulating Paste Adhesive:

• 100% solid, insulating lid-seal that cured inline at temperature of 175-200°C in a few seconds.
• Low coefficient of expansion (CTE) of less than 20 ppm/°C with low moisture absorption of less than 0.5% at saturation for long-term device reliability under thermal and environmental stresses.
• High glass transition of 240°C and long-term molecular stability above 300°C to ensure both standard commercial and military applications of 85C and 150°C continuously. It also enables the special ultra high temperature operational as sensors and electronic devices in oil wells and other specialty environments.

2. MC8880 paste adhesive:

• 100% solid, electrically conductive lid-seal that cured inline at temperature of 175-200°C in a few seconds.
• Low coefficient of expansion (CTE) of less than 25 ppm/°C with low moisture absorption of less than 0.5% at saturation for long-term device reliability under thermal and environmental stresses.
• High glass transition of 240°C and long-term molecular stability above 300°C to ensure both standard commercial and military applications of 85°C and 150°C continuously. It also enables the special ultra high temperature operational as sensors and electronic devices in oil wells and other specialty environments.

Solderable Ceramic, Glass and LCP Lids

Pre-Applied Adhesive Preforms

EMI Shielding Covers, Lids, and Caps without soldering

SNAP-LID® Adhesive Preform Pre-application

在塑料、陶瓷、金属盖子上预涂胶的低成本预涂胶。用于热塑性塑料和环氧树脂基粘合剂的在线加工的瞬间粘合。AI Technology可在您的零件上提供预涂胶或提供完整的解决方案。

COOL-LID® Lid Attach to Combine with Thermal Management

A solution incorporating heat-spreading interface from a flip chip device and module to the lid cover is accomplished with an AI Technology adhesive that is pre-applied and provides for a rapid bonding lid attach.This new technology combined the now world-renown COOL-PAD™ interface solution for devices generating more than 100 watts within a square inch area along with the snap-curing adhesive preform combine to provide a winning solution for the majority of lid attachment applications. COOL-LID® is a special cost effective patent-pending process where pre-application of thermal interface material and lid-seal adhesive are used. Lids may be constructed of copper, aluminum, and ceramics. If thermal performance is not critical, even plastic caps can be used. The B-staged lid seal adhesive and interface pad are dry to the touch and are ambient storable for 12 months. Both the adhesive and interface material will tack onto a substrate and form an intimate thermal contact at 150°C in a matter of seconds with nominal pressure of 10 psi. Full cure is achieved without pressure at 150°C in less than 5 minutes.

LID-SEAL: Low Cost Sealing, Thermal & Shielding Solutions

Adhesive Preforms (Adhesive Film Pre-application for optical, component, and module lid sealing)

在金属、陶瓷、光学玻璃或LCP盖子上预涂胶，成本低，已获专利。热塑性和环氧树脂基胶粘剂的在线加工的瞬间粘合。AI Technology为您的零件提供预涂胶，或提供光学盖板的完整解决方案。可通过微细和毛漏和85%RH/85C老化，不会起雾或改变粘接强度。

Solderless EMI Shielding with Pre-application Adhesives

低成本的即溶型导电胶预制件，可取代焊接在PWB上，预涂抹的成本低。预涂压敏胶的瞬间插入粘接，具有屏蔽效果。可选择原位固化，加热后可增加强度，即时粘合，适用于热塑基导电盖屏蔽和密封胶的在线加工。AI Technology将在您的零件上预涂粘合剂，或提供金属盖和盖子的完整解决方案。

欲了解更多信息和推荐帮助，请联系AI Technology销售和工程部。

AIT sales and customer service: 1-609-799-9388 or Fax: 609-799-9308