Ultra High Thermally Conductive Insulated Metal Substrate for Metal Core Printed Circuit Board (MCPCB) Applications:
- LED Substrate with outstanding heat dissipation and dielectric strength between metal layers
- Insulated aluminum substrate laminate with insulated copper cladding on aluminum substrate heat-spreader
- 20 inch by 24 inch panel
- 40 and 60 mil aluminuum heatspreading plate
- 1 oz, 2oz, 3oz or custom copper thicknesses
- No fiber-glass mesh to deter thermal dissipation
- Controlled dielectric thermal interface layer of 3 mil (75 micron) with custom thickness available
- Low to zero interfacial stress between copper and aluminum with proven reliability
- Standard insulated metal thermal substrates (IMTS) measured and proven to have two times (2X) higher thermal conductivity
- Specialty Diamond filled metal core printed wiring board (MCPWB) insulated metal thermal substrate: first and only industry availability
A flexible solar panel is one of the circuit applications that can benefits from the flexible insulated thermal substrate with copper cladding on both side of the thermally conducting insulating dielectric that are pioneered by AIT engineers.
Industry's First Flexible Insulated Metal Substrate for Metal Core Printed Circuit Board (Flexible MCPCB) LED Substrate Applications:
- Flexible and conformable for specialty high power devices and modules
- Insulated copper substrate laminates with copper cladding on copper substrate heat spreader
- 20 inch by 24 inch sheet for standard applications
- Roll of other lengths are available for custom application
- 1 oz, 2oz, 3oz or custom copper thicknesses
- Thin and no fiber-glass mesh to deter thermal dissipation
Flexible LED lighting can benefits from the low cost AIT flexible insualted metal substrate that set the benchmark of thermal conductivity and thermal impedance as LED substrate
For more information and recommendation assistance, please contact AIT sales and engineering:
AIT technical sales and service department can also be reached at: 1-609-799-9388 or 1-800-735-5040 (EST) and Fax: 609-799-9308
Thermal Substrate Laminate or Insulated Metal Substrate For Led, Power Module, High Power Device and Metal Core Printed Circuit Board (MCPCB) Applications
COOL-CLAD™ insulated metal thermal substrate laminate for metal core printed circuit boards (MCPCB) with low thermal impedance are used for chip-on-board, insulated metal PCB and device sub-mount structure LED packaging application. AIT insulated metal thermal substrate with either aluminum or copper metal heat spreader does not use the more conventional fiber-glass meshed thermal laminate of insulated metal substrates, instead its uses AIT proven high thermal crystallite filled molecularly flexible polymer that is hydrophobic and having almost zero internal interfacial stress for long-term reliability. It has tested and proven with twice the thermal conductivity and 100% less thermal impedance. As LED substrate, it is an ideal solution for high brightness LED lighting applications.
LED signal lights and LED displays are one of the applications that benefits from the ease of fabrication using standard PWB manufacturing processes and technologies. With two times lower in thermal impedance, AIT insulated metal substrate with two times thermal conductivity in comparison to traditional insulated metal substrate provides the unparalleled lighting efficiency and reliability.
COOL-CLAD™ metal core printed circuit board substrate laminates are ideal for the most demanding thermal management applications requiring low thermal impedance:
- COOL-CLAD™ CL is insulated aluminum metal substrate designed for LED lighting, high power module; and power devices that requires ultra-low thermal impedance for both large and small area circuits.
- COOL-CLAD™ CC series is flexible thermal substrate with insulated copper laminate that is ideal for large area LED display; LCD TV and LED backlight units.
AIT insulated metal (metal core printed circuit board) thermal substrate is made with process and materials that does not use fiberglass mesh and thus optimize the thermal conductivity for the lowest thermal resistance and thermal impedance.
Key Benefits of COOL-CLAD™ insulated metal (metal core printed wiring board) thermal substrates:
- Reduces the thermal impedance to half and thus lower chip temperature to increase light output
- LED lightings extend its useful life further than those using standard insulated metal substrates.
- Stress free with proven robustness, reliability against high temperature and thermal cycling for long-term durability.
Compliance and Additional Benefits:
- RoHS compliant
- Fire rating: V-0
- Lead free solder compatibility
Large LED display can be formed into shape and curvature easily with the use of the flexible insulated metal thermal substrate available only from AI Technology, Inc.
Key Applications of LED Substrates of Insulated Metal Laminates:
- LED lighting
- LED Display
- LCD Display Backlighting for computers, televisions and monitors.
