AI Technology, Inc.

• 1: Home
• 2: Company
• 3: Products & Solutions
  • 3.1: Die Attach Adhesive Solutions
    • 3.1.1: Die Attach Paste Adhesives
    • 3.1.2: Die Attach Film Adhesives
    • 3.1.3: Die Attach Adhesive FAQs
  • 3.2: Substrate and Component Attach
    • 3.2.1: Component & Substrate Attach Paste Adhesives
    • 3.2.2: Substrate Attach Film Adhesives
  • 3.3: Thermal Interface Materials & Insulated Metal Substrates
    • 3.3.1: Compressible Phase-Change Interfaces
    • 3.3.2: Thermal Film and Paste Adhesives
    • 3.3.3: Thermal Gels & Greases
    • 3.3.4: Insulated Metal Substrate Copper Clads & Pre-Preg
    • 3.3.5: Thermal Management Tips and FAQs
  • 3.4: Flexible and Advanced Circuit Substrate Materials
    • 3.4.1: Solderable Flexible 1 and 2-Sided Copper Laminates
    • 3.4.2: Low Pressure Copper Pre-Preg
    • 3.4.3: Advanced Circuit Substrate Materials
  • 3.5: Lid Seal Solutions
    • 3.5.1: Lid Seal Preforms
    • 3.5.2: Solderable Insulating Lids
  • 3.6: Dicing & Grinding Tapes and Greases
    • 3.6.1: Dicing Tapes
    • 3.6.2: Grinding Tapes and Greases
    • 3.6.3: Dicing & Grinding Tape FAQs
  • 3.7: Flip Chip Adhesive Bumps
  • 3.8: EMI/RFI Shielding & ESD Protection Materials
    • 3.8.1: Compressible Gasket Sheets
    • 3.8.2: Shielding Caulks and Adhesives
    • 3.8.3: Melt-Bonding Lid-Shield
    • 3.8.4: ESD Protection Coatings & Materials
    • 3.8.5: EMI Shielding Tips and FAQs
  • 3.9: MIL-STD 883C 5011.4 Compliant
  • 3.10: NASA Outgassing Compliant
  • 3.11: Custom Adhesive & Material Solutions
• 4: Contact
• 5: Resources & Glossary
  • 5.1: Adhesive Bonding Principle
  • 5.2: Rework Process
  • 5.4: Patents & IP
  • 5.5: ISO 9001:2000 Certification
• 7: News & Shows
  • 7.1: News Releases
  • 7.2: Newsletter-Adherent
• 8: Online Store
• 9: Employment
• 10: Legal

AIT pioneered the use of flexible die-attach film for large area die-attachment and has since achieved 20 years of proven reliability. Continuing with this innovative heritage, the following "Die-Attach Film" adhesives represents products that are engineered for manufacturability and reliability:

·         Die-attach film that can be pre-applied onto wafer by lamination or screening

·         Applicable for dicing with UV-release tape

·         Instant melt-tack with nominal pressure and finishing inline curing without fixture or  pressure

·         Ability to withstand 250°C wire-bonding

·         Low moisture absorption to achieve soldering of components without pre-baking

·         Industry first “instant melt-bondable” thermoplastic die-attach films

Click on the Product for the TDS

Non-conductive Film Adhesives

AIT offers many other Die Attach paste adhesives not shown on our web site. Please go to Products Application Form to receive a recommendation from our office on your specific application.

AIT offers many other Die Attach paste adhesives not shown on our web site. Please go to Products Application Form to receive a recommendation from our office on your specific application.

Die-attach-film (DAF) is engineered for "tack-and-cure" process. This allows for tacking the die onto the substrate with low temperature (80-160°C) and low pressure (4-8 psi) for short time (1-2 seconds). It then is  followed by a curing process without pressure at a temperature that fits the manufacturing process. 

AIT die-attach film adhesives are engineered to have a balance of high temperature bond strength to allow wire-bonding operations up to 275°C and low stress for larger dies.

DAF has a long history of success in performance under extreme temperature and humidity. The following graph is a reflection of the low moisture absorption and potential for packaging components for lead-free soldering without pre-baking.

DAF has more than 10 years of proven success in stacking multiple chips for high reliability applications. Part of the atributes for its success is the ability to withstand high temperature without degradation. The following graph illustrates the unparalleled molecular stability among DAF.