Dicing Die-Attach Film (DDAF) or Dicing Die-Attach Tape for: Chip Scale Packaging, Stack-Chip Packaging, Through Silicon (STV) Via Filling and Underfill

AI Technology, Inc. pioneered the use of flexible die-attach film and paste adhesives for larger chip and die bonding in the early 1980s. The company has since found success in extending its adhesive line to have the widest selection in the industry. They have been designed for the combination of performance and manufacturing efficiency. The following are a few examples:

1. Rapid-curing die-attach adhesive paste for typical dies:

• Rapid curing at 150-250°C in seconds
• Maintains more than 300 psi bond strength @ 250°C for fast wire-bonding
• Molecularly engineered for low moisture absorption and high temperature stability
• Designed for dies less than 1 cm
• Examples: ME7635-RC, ME8630-RC
• Ultra-High Temperature, 300°C continuous use paste adhesiveS
• Examples: MC7888, MC8880

2. Rapid-curing die-attach adhesive paste for large dies:

• Rapid curing at 150-250°C in seconds
• Maintains more than 300 psi bond strength @ 150°C for typical wire-bonding
• Molecularly engineered for low moisture absorption and high temperature stability
• Designed for dies larger than 1 cm
• Examples: ME7655-RC, ME8650-RC

3. Rapid-curing die-attach film (DAF) adhesive for stack chip packaging:

• Tacks at 80-150°C in seconds with minimal pressure of 4-8 psi
• Rapid curing without pressure at select temperature
• Maintains more than 300 psi bond strength @ 250°C for fast wire-bonding
• Molecularly engineered for low moisture absorption and high temperature stability
• Designed for dies less than 1 cm
• Examples: ESP7670-WL, ESP8680-WL
• Ultra-High Temperature, 300°C continuous use applicable film adhesives
• Examples: CXP7888, CXP8880

4. Rapid-curing die-attach film (DAF) adhesive for reliable stacked chip packages with large dies:

• Tacks at 125-150°C in seconds with minimal pressure of 4-8 psi
• Rapid curing without pressure at select temperature
• Maintains more than 300 psi bond strength @ 150°C for typical wire-bonding
• Molecularly engineered for low moisture absorption and high temperature stability
• Designed for dies larger than 1 cm
• Examples: ESP7450-WL, ESP8450-WL

AIT technology has the capability of combining its UV-releasing dicing tape (UVR 250) and its rapid-curing in-line "Tack-and-Cure" die-attach film adhesive (ESP7660, CXP7860) for the ultimate in manufacturability for stack-chip packages.

AIT Dicing Die-Attach Film (DDAF) differs from the more traditional B-staged film adhesive with a different molecularly structure for fast melt-flow that allows for low temperature and low pressure tacking and then post-curing without pressure.

Other Specialty Die Attach Applications

1. Screen-printable rapid-curing die-attach film (DAF) adhesive:

• Screen-printable
• Tacks at 80-150°C in seconds with minimal pressure of 4-8 psi with rapid curing without pressure at select temperature
• Alternative inline tack-and-curing at 250°C within seconds
• Maintains more than 300 psi bond strength @ 250°C for fast wire-bonding
• Molecularly engineered for low moisture absorption and high temperature stability
• Designed for dies less than 1 cm
• Examples: LESP7670-WL, LESP8680-WL

2. Ultra-high thermally conductive die-attach adhesive pastes:

• Proven for military electronics and thermal performance
• Molecularly engineered for high temperature stability
• Designed for large and small dies
• Examples: ME8456-DA, ME8650-RCT

3. Ultra-high temperature stable die-attach film & paste adhesives for 300°C continuous applications:

• Molecularly engineered interpentrating network film and paste adhesives for military electronics and high temperature electronics
• Molecularly engineered for high temperature stability and low CTE with high moisture resistance
• Designed for large and small dies
• Examples of paste die-attach adhesives: MC7888, MC8880
• Examples of film die-attach adhesives: CXP7888, CXP8880

4. Flip-Chip Direct Contact Attach Film and Liquid Underfill for stack chip packaging and through silicon via (STV) filling:

• Molecularly engineered interpentrating network film and paste adhesives for military electronics and high temperature electronics
• Molecularly engineered for high temperature stability and low CTE with high moisture resistance
• Designed for large and small dies
• Examples of flip-chip direct attach film and paste adhesives: CM7880, CXP7880-UF

For more information on recent developments of Die-Attach Adhesives:

AIT technical sales and service department can also be reached at: 1-609-799-9388 or 1-800-735-5040 (EST) and Fax: 609-799-9308