AI Technology, Inc.

• 1: Home
• 2: Company
• 3: Products & Solutions
  • 3.1: Die Attach Adhesive Solutions
    • 3.1.1: Die Attach Paste Adhesives
    • 3.1.2: Die Attach Film Adhesives
    • 3.1.3: Die Attach Adhesive FAQs
  • 3.2: Substrate and Component Attach
    • 3.2.1: Component & Substrate Attach Paste Adhesives
    • 3.2.2: Substrate Attach Film Adhesives
  • 3.3: Thermal Interface Materials & Insulated Metal Substrates
    • 3.3.1: Compressible Phase-Change Interfaces
    • 3.3.2: Thermal Film and Paste Adhesives
    • 3.3.3: Thermal Gels & Greases
    • 3.3.4: Insulated Metal Substrate Copper Clads & Pre-Preg
    • 3.3.5: Thermal Management Tips and FAQs
  • 3.4: Flexible and Advanced Circuit Substrate Materials
    • 3.4.1: Solderable Flexible 1 and 2-Sided Copper Laminates
    • 3.4.2: Low Pressure Copper Pre-Preg
    • 3.4.3: Advanced Circuit Substrate Materials
  • 3.5: Lid Seal Solutions
    • 3.5.1: Lid Seal Preforms
    • 3.5.2: Solderable Insulating Lids
  • 3.6: Dicing & Grinding Tapes and Greases
    • 3.6.1: Dicing Tapes
    • 3.6.2: Grinding Tapes and Greases
    • 3.6.3: Dicing & Grinding Tape FAQs
  • 3.7: Flip Chip Adhesive Bumps
  • 3.8: EMI/RFI Shielding & ESD Protection Materials
    • 3.8.1: Compressible Gasket Sheets
    • 3.8.2: Shielding Caulks and Adhesives
    • 3.8.3: Melt-Bonding Lid-Shield
    • 3.8.4: ESD Protection Coatings & Materials
    • 3.8.5: EMI Shielding Tips and FAQs
  • 3.9: MIL-STD 883C 5011.4 Compliant
  • 3.10: NASA Outgassing Compliant
  • 3.11: Custom Adhesive & Material Solutions
• 4: Contact
• 5: Resources & Glossary
  • 5.1: Adhesive Bonding Principle
  • 5.2: Rework Process
  • 5.4: Patents & IP
  • 5.5: ISO 9001:2000 Certification
• 7: News & Shows
  • 7.1: News Releases
  • 7.2: Newsletter-Adherent
• 8: Online Store
• 9: Employment
• 10: Legal

The following is a list of some AI Technology, Inc. patents that are available for licensing:

         Patent #     Title

1. 7,154,046   Flexible dielectric electronic substrate and method for making same

2. 6,973,716   Electronic circuit construction method, as for a wireless RF tag

3. 6,938,783   Carrier tape

4. 6,717,819   Solderable flexible adhesive interposer as for an electronic package, and method for making same

5. 6,581,276   Fine-pitch flexible connector, and method for making same

6. 6,580,035   Flexible adhesive membrane and electronic device employing same

7. 6,580,031   Method for making a flexible circuit interposer having high-aspect ratio conductors

8. 6,496,373   Compressible thermally-conductive interface

9. 6,432,253   Cover with adhesive preform and method for applying same

10. 6,428,650   Cover for an optical device and method for making same

11. 6,409,859   Method of making a laminated adhesive lid, as for an Electronic device

12. 6,406,988   Method of forming fine pitch interconnections employing magnetic masks

13. 6,399,178   Rigid adhesive underfill preform, as for a flip-chip device

14. 6,376,769   High-density electronic package, and method for making same

15. 6,316,289   Method of forming fine-pitch interconnections employing a standoff mask

16. 6,297,564   Electronic devices employing adhesive interconnections including plated particles

17. 6,136,128   Method of making an adhesive preform lid for electronic devices

18. 6,108,210   Flip chip devices with flexible conductive adhesive

19. 4,695,404   Hyperconductive filled polymers