MOLECULARLY FLEXIBLE EPOXY FLEXIBLE CIRCUIT SUBSTRATE
CONDUCTIVE COATINGS/GASKETS FOR EMI SHIELDING: THEORY AND PRACTICE
MULTICHIP MODULE DIE-ATTACH WITH LOW STRESS, THERMALLY CONDUCTIVE EPOXIES
THERMAL IMPEDANCE AND THERMAL STRESS IN ELECTRONIC ASSEMBLIES CHARTS
FUEL AND MOISTURE RESISTANT ADHESIVES FOR AUTOMOTIVE ELECTRONICS & OTHER APPLICATIONS
Flexible, Reworkable, Conductive Adhesive/Coating For Interconnection Applications
TACK-FREE FLEXIBLE FILM ADHESIVES
Low Tg Epoxy Adhesives for Thermal Management
Z-POXY AS SOLDER REPLACEMENT FOR SURFACE MOUNTING APPLICATIONS
Z-AXIS CONDUCTIVE ADHESIVE FOR TAB AND FINE PITCH INTERCONNECTS
Development of Z-Axis Adhesives for SMT Assembly
Ball-Grid-Array Package Thermal Management
NEW APPROACH TO LOW COST CAVITY PACKAGING
Second Generation Die and Substrate Attach Flexible Film Adhesive
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