White Papers From AIT
Molecularly Flexible Epoxy Flexible Circuit Substrate
Conductive Coatings/Gaskets For Emi Shielding: Theory And Practice
Multichip Module Die-Attach With Low Stress, Thermally Conductive Epoxies
Thermal Impedance And Thermal Stress In Electronic Assemblies CHARTS
Fuel And Moisture Resistant Adhesives For Automotive Electronics and Amp; Other Applications
Flexible, Reworkable, Conductive Adhesive/Coating For Interconnection Applications
Tack-Free Flexible Film Adhesives
Low Tg Epoxy Adhesives for Thermal Management
Z-POXY As Solder Replacement For Surface Mounting Applications
Z-AXIS Conductive Adhesive For Tab And Fine Pitch Interconnects
Development of Z-AXIS Adhesives for SMT Assembly
Ball-Grid-Array Package Thermal Management
New Approach To Low Cost Cavity Packaging
Second Generation Die and Substrate Attach Flexible Film Adhesive
For more information and recommendation assistance, please contact AIT sales and engineering:
AIT technical sales and service department can also be reached at: 1-609-799-9388 or 1-800-735-5040 (EST) and Fax: 609-799-9308
