Wafer Dicing Tapes

Key Features of AIT Wafer Dicing Tapes:

Release-on-demand by exposure to UV irradiation to enable pick up of largest of dies.
Low ionic impurities and doesn’t impart contamination of metal ions from adhesive.
Outstanding expandability to prevent contact damage to dies and wafer.
Controlled bond strength and hydrophobic to enable dicing under water-jet without peeling or slippage.
Complies with and supports the working environment of class 100 (ANSI 209b) requirements.

Functions and Benefits of AIT Dicing Tapes:

Two grades of peel strength (250 and 500 gm/in) for both UV releasing type and non-UV releasing types to accommodate different dicing speeds and die sizes.
Industry’s unique high temperature dicing tape with both flexible substrate and adhesive to withstand temperature up to 250°C for post and pre-dicing operations.
Suitable for dicing panels for packages, ceramics and glass components
Support laser cutting besides traditional blade dicing.
Maintains stable peel strength for 12 months in original packaging to facilitate transportation of diced wafer and panels.

Made-In-USA: UV Releasing, Pressure Sensitive and High Temperature Dicing Tapes to Serve Customers Worldwide

New Die-Attach film availability: AIT is now producing wafer die-attach film in wafer sizes up to 12-inches in combination with dicing tape in reel-to-reel format. AIT’s made-in-the-USA DDAF and packaging presentation is similiar to Lintec, Hitachi and other Japanese suppliers.

Proven and Unparalleled Advantages:

Unique high temperature capability
Outstanding expandability and stability
Proven anti-static capability
Proven anti-chipping
Stable and consistent peel strength
Proven for the smallest and largest dies
Roll-to-roll presentation for highest volume dicing applications

UV-Releasing Wafer, Panel and Substrate Dicing Tape with Anti-Static Capability

AIT Product	Characteristics	Electrical	Applicable Temperatures (oC)	Peel Strength(gm/inch)
UVR500	PO-PVC-AIT proprietary backing Silicone-free Stable peel strength UV Releasing 25 micron adhesive on 75 miron liner	Anti-static	Ambient to 150°C Large and small dies	500
UVR250	PO-PVC-AIT proprietary backing Silicone-free Stable peel strength UV Releasing 25 micron adhesive on 75 miron liner	Anti-static	Ambient to 150°C Large and small dies	250
UVR500-DS	PO-PVC-AIT proprietary backing Silicone-free Stable peel strength UV Releasing 25 micron adhesive on 75 miron liner	Anti-static	Ambient to 150°C Large and small dies	500
UVR250-DS	PO-PVC-AIT proprietary backing Silicone-free Stable peel strength UV Releasing 25 micron adhesive on 75 miron liner	Anti-static	Ambient to 150°C Large and small dies	250

High Temperature Wafer, Panel and Substrate Dicing Tape with Anti-Static Substrate

AIT Product	Characteristics	Electrical	Applicable Temperatures (oC)	Peel Strength(gm/inch)
HTCR500	AIT proprietary backing Silicone-free Stable peel strength 25 micron adhesive on 75 miron liner	Anti-static	Ambient to 150°C Up to 300°C intermittent	500
HTCR250	AIT proprietary backing Silicone-free Stable peel strength 25 micron adhesive on 75 miron liner	Anti-static	Ambient to 150°C Up to 300°C intermittent	250
HTCR500-DS	AIT proprietary backing Silicone-free Stable peel strength 25 micron adhesive on 75 miron liner	Anti-static	Ambient to 150°C Up to 300°C intermittent Tacky on both sides	500
HTCR250-DS	AIT proprietary backing Silicone-free Stable peel strength 25 micron adhesive on 75 miron liner	Anti-static	Ambient to 150°C Up to 300°C intermittent Tacky on both sides	250

For a recommendation, information or assistance, please contact AIT sales and engineering:

AIT technical sales and service department can also be reached at: 1-609-799-9388 or 1-800-735-5040 (EST) and Fax: 609-799-9308