Adherent - May 2011
News and Updates from AI Technology Inc.
With the summer season nearly upon us, AI Technology has been hard at work developing new materials and reaching out to new markets. We have recently set up LinkedIn company page for AIT. Please connect with us to stay informed about new products and upcoming events.
Silver Price Increase
Due to the dramatic increase in silver prices which began in early 2011, AIT will add a SILVER SURCHARGE to all price quotations for silver filled materials beginning May 1, 2011. This surcharge will reflect the increase in silver costs being passed on to AIT by our suppliers.
AI Technology, Inc. thanks you for your continued business and will provide the highest quality products and services to meet your needs.
New AIT Materials
RTK7555-LB This is a reworkable, super fine alumina crystallite filled, epoxy film adhesive. It offers excellent flexibility and reworkability at 80-150C. It has high thermal conductivity and the low Tg adhesive imposes minimum thermal stress on bonded parts during thermal cycling or chock testing. This is an excellent product when extra thin bond lines and high die shear numbers are needed. Contact AIT today to sample this product for your die attach needs.
MC7883-UF Using a low CTE, high temperature stable resin, AIT has developed a new underfill material. This high modulus material offers very low ionic impurities as well as outstanding moisture resistance. The low viscosity allows for easy capillary pull in of the material under the component.
ME8518-LED Improved from one of our proven die attach material. This solvent-free highly silver filled epoxy is designed for exceptional thermal conductivity. Updated for the LED market this material will be a great fit for many high power density die attach applications.
Trade Show Updates
In February AIT attended the LED conference; Strategies in Light located in the Santa Clara convention center. Over 4,200 people attended from all over the world. AIT had displayed many of their epoxies and thermal management materials at the show. Many of the LED manufacturers exhibiting at this show have already use AIT products to enhance the performance of their devices.
At the APEX conference in Las Vegas in April there were over 7,000 attendees this year. Many of the visitors to the AIT booth were unaware that we had so many different thermal interface materials to offer them. Most of our thermal interface pads are custom made to the thickness and compression standards required to meet tight tolerances required of state of the art back end packaging designs. The thermal conductivity our products provide are the highest available in the market and can be obtained with "silicon-free" gels, greases, pad and epoxies.
