描写
COOL-GAPFILL™ DT G4 is a new class of thermal interface material that dispenses like a thermal pad but performs with characteristics like that of a grease or gel. It is filled with a modified oxide admixture, crystallite filled, electrically insulating at normal voltage, and engineered for large area and gap filling interface applications. It is designed to have high compressibility and instant flow to enhance thermal transfer from a power device to heat sink.
COOL-GAPFILL™ DT G4两面略带粘性，可实现最佳的热传导性能。COOL-GAPFILL™ DT G4具有较高的导热性能，低Tg的胶粘剂在热循环或冲击测试时对粘接件的热应力最小。
COOL-GAPFILL™ DT G4 is designed for thermal gap filling of GPU for Xbox360, PlayStation, and other game consoles. It is also ideal for bridging the thermal gap for graphic chips and cards in laptops for Asus, Samsung, BenQ, Foxconn and other OEM.
