倒装芯片底料和球栅阵列底料

传统的底层填充和球顶材料与酸酐环氧树脂的Tg约为100-150°C，在250°C回流焊接时，可能会产生过高的界面拉伸应力。新一代的AIT底层填充材料和球顶化合物具有不同的化学成分，可以在240℃的超高Tg下实现新的性能。°AI科技的封装产品采用了高热传导率和低热界面电阻，可为倒装芯片封装的顶部和底部的热量传递提供动力。请点击这里查看视频，了解AI科技的底层填充和球顶封装产品如何助力倒装芯片和板载芯片实现更高性能的详细信息。

AI Technology的底层填充物的独特之处在于其无与伦比的应力管理能力，同时提供了出色的防潮性能。 这些能力是通过非常规的聚合物工程和设计实现的。 AI Technology先进的微电子保护产品是在高温下工作的大型高性能器件的理想选择。

High Tg of 175-240C of the new generation of AIT thermally conductive underfill compounds coupling with molecular level stress absorption capability enables many high-performance flip-chip packaging including power devices.

传统的酸酐固化环氧树脂在进行250C的回流焊时，对新型无铅焊接的应力吸收能力有一定的限制。

  • 除了传统的150℃的高温应用外，还可在150-300℃以上的高温下使用。
  • 经过验证的不耐湿性和低吸湿性使其在JEDEC元件可靠性方面达到了1级。
  • 符合RoHS、REACH和WEEE标准，达到UL94V-0等级。

同样具有应力吸收能力的高Tg倒装片下填充料也可用于印刷电路板上的球栅阵列封装的应力管理。

New Generation of Ultra High Tg Film Underfill

Chip-on-chip with copper pillar interconnections or gold-stud bumps is best with underfill CTE less than copper at 18ppm/°C. Chip-on-package such as BT or equivalent having CTE of 12 ppm/°C is best filled with underfill with CTE as close to 12 ppm/°C as possible. UF-MC7883-FP having below 16 ppm/°C CTE and capillary gap filling capability of less than 35μm meets 3-D and chiplets packaging requirements.

FOW的高熔体流动膜下填充。

  • 在堆叠芯片应用中具有出色的熔融流动性和润湿性，可用于堆叠芯片应用中的过流线。
  • 能够在100-150°C的低温度下固化，降低界面应力。
  • 大面积堆叠芯片和模块的理想选择
  • Preform with specific thickness accommodates the flip-chip or ball-grid-array parts with preformed cut-outs for interconnections allowing the film adhesive to flow and encapsulate for protection

Flow-Over-Wire线下填充膜胶可用于大规模晶圆级封装，采用DDAF格式。

填充液和薄膜粘合剂。

功能AI Technology部分# 热能、电力及其他相关财产
Underfill Film Adhesive for Wafer or ChipUFF-ESP7770
  • Tg ~175°C to ensure minimal stresses during and post reflow soldering
  • High melt-flow at 80-100°C to wafer level lamination with dicing tape with 12-month ambient storage for chips with pre-applied underfill film
  • Outstanding fiducial transparency for ease of dicing and chip placement
  • High melt-flow and remaining liquidous during interconnection-soldering
  • Molecularly engineered for shear stress and moisture protection
Underfill Film Adhesive for Wafer or Chip

(REWORKABLE)

UFF-RW-ESP7760
  • Tg ~175°C to ensure minimal stresses during and post reflow soldering
  • High melt-flow at 80-100°C to wafer level lamination with dicing tape with 12-month ambient storage for chips with pre-applied underfill film
  • Outstanding fiducial transparency for ease of dicing and chip placement
  • High melt-flow and remaining liquidous during interconnection-soldering
  • Molecularly engineered for shear stress and moisture protection
Underfill Film Adhesive for Wafer or Chip
UFF-CXP7880
  • Tg ~240°C to ensure minimal stresses during and post reflow soldering
  • High melt-flow at 80-100°C to wafer level lamination with dicing tape with >6-month ambient storage for chips with pre-applied underfill film
  • Outstanding fiducial transparency for ease of dicing and chip placement
  • High melt-flow and remaining liquidous during interconnection-soldering
  • Molecularly engineered for shear stress and moisture protection
Underfill Film Adhesive for Wafer or Chip

(REWORKABLE)

UFF-RW-CXP7860
  • Tg ~240°C to ensure minimal stresses during and post reflow soldering
  • High melt-flow at 80-100°C to wafer level lamination with dicing tape with >6-month ambient storage for chips with pre-applied underfill film
  • Outstanding fiducial transparency for ease of dicing and chip placement
  • High melt-flow and remaining liquidous during interconnection-soldering
  • Molecularly engineered for shear stress and moisture protection

The ultra-high glass transition temperature (Tg) at 240°C minimizes tensile stress induced failures when the flip-chip packages are going through the reflow soldering of lead-free solder.

欲了解更多信息和推荐帮助，请联系AI Technology销售和工程部。

AIT technical sales and service department can also be reached at: 1-609-799-9388 or fax: 609-799-9308