关于我们

爱尔科技在设计和制造各种形式的高性能"无应力"柔性胶粘剂薄膜和浆料以及微电子封装和热管理应用的热界面材料方面拥有超过29年的经验。我们最新的研究成果是以更高性能、更低成本、可焊接的柔性电路基板材料取代聚酰亚胺基有机铜包层材料在高频、RFID领域的应用，以及以低介电常数损耗和低吸湿性取代PTFE基板材料在微波电路领域的应用。我们的技术和产品包括无溶剂模具和基材贴合膏和薄膜、可压缩的热垫填充相变热界面材料、热凝胶、热润滑脂、聚合物基Solder-Sub®柔性导电胶，用于细间距互连中的焊料替代。用于光电子传感器和器件的陶瓷和金属盖子及光学玻璃盖子的近乎封闭的盖子密封剂，EMI屏蔽垫片/胶粘剂/填缝材料，双面UV脱模晶圆研磨带和高温静电自由切割带。

我们的历史

自1985年率先将柔性环氧树脂技术应用于微电子封装以来，爱尔科技已成为电子互连和封装领域先进材料和胶粘剂解决方案的开发和专利应用的领先力量之一。目前，AI Technology拥有可靠性最高的胶粘剂和下填充物之一，可用于最大模具的裸片键合、堆叠芯片封装的丁字模贴膜(DDAF)、倒装芯片键合和下填充物，以及单芯片和多芯片模块的高温裸片键合，应用温度超过230℃。该公司继续为军事和商业应用提供组件和基材键合的粘合剂解决方案。其热界面材料解决方案包括专利相变热垫、热脂和凝胶以及热粘合剂，为功率半导体、模块、计算机和通信电子设置了许多性能和可靠性的基准。

The company has an ISO9001:2008 certified manufacturing and R&D facility in the U.S. and a Far East Center in Hong Kong. The US headquarters has more than 50,000 square feet of manufacturing facilities for its die and substrate attached adhesive films and pastes, thermal interface materials (TIM) including insulated metal substrates, gap-filling compressible phase-change pads, thermal gels, thermal greases and adhesive films and pastes. AI Technology provides electromagnetic and radio frequency interference (EMI/RFI) mitigation material solutions including conductive gaskets, form-in-place (FIP) conductive gaskets, self-attached shielding covers/cans/lids, conductive caulks and adhesives, ultra-high temperature (300°C) continuous use films and paste die and component adhesives and advanced organic copper-clad laminates from 1/4 oz to 1 oz copper within its 16-acre campus in Princeton Junction, NJ.

AIT application engineering, sales, chemists, and material scientists are ready to design and manufacture to your application’s requirements and specifications. Please inform us of your requirements using the Contact tab or click on the button below:

AIT sales and product support:
1-609-799-9388
Fax: 609-799-9308