A New Class of 3-D Wafer Build-up Pre-pregs

  • Nano-filler with molecularly engineered stress-relief high Tg modified cyanate ester
  • Engineered CTE to match copper or HDI core board for build-up flexibility
  • Low moisture absorption and low dielectric constant for reliability and performance
Build-up prepreg applications required some extreme polymer and adhesive engineering to achieve the many different performance and reliability parameter. Matching CTE of the core BT substrate at around 12ppm/°C and copper at 18 ppm/°C is one of the many critical factors to the long-term reliability of the 3D and chiplets applications. The AIT BUF 7883-FP represents a new class of build-up film adhesive that is proven to have all of the critical performance while providing high melt-flow to high productivity.

AIT Build-up Film Pre-pregs advancing 3-D heterogenous chip Integrations:

  • AIT build-up film represents a new class of build-up film adhesive prepregs with nano-fillers (BUF-NP product line) to advance the micron-sized lines and micro-vias in the 3-D wafer heterogenous integration.
  • BUF-FP build-up film prepreg lines with 10µm cut-off filler size is designed to supplement the current 3-D integration supply shortages.
  • AIT has expanded its film production capability in two locations in United States while working on additional production capacity in China in meeting the buildup film shortage challenges.
Build-up prepreg matching CTE of the core BT substrate at around 12ppm/°C and copper at 18 ppm/°C is critical to the long-term reliability of the 3D and chiplets applications. The AIT BUF 7883-FP cured on copper at 150°C on the above right picture demonstrated CTE far less than that of copper.