描写
PRIMA-SOLDER™ (EG8050)是一种导电性、充满银的环氧树脂，具有出色的柔韧性，可用于粘接具有高度不匹配CTE的材料（如氧化铝与铝、硅与铜）。建议使用真空或气流烘箱在100C或125C下烘烤24小时，以通过NASA的排气测试。
EG8050 can be readily reworked at 80-150ºC and is ideal for applications such as large area die attach and substrate attach because of its ability to bond materials with highly mismatched CTE.
